发明授权
- 专利标题： Selective metallization process
- 专利标题（中）： 选择性金属化工艺
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申请号： US600712申请日： 1984-04-16
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公开(公告)号： US4537799A公开(公告)日： 1985-08-27
- 发明人: John K. Dorey, II , Steven L. Schmidt , Wesley P. Townsend
- 申请人： John K. Dorey, II , Steven L. Schmidt , Wesley P. Townsend
- 申请人地址： NY New York
- 专利权人： AT&T Technologies, Inc.
- 当前专利权人： AT&T Technologies, Inc.
- 当前专利权人地址： NY New York
- 主分类号： C23C18/16
- IPC分类号： C23C18/16 ; H05K3/18 ; B05D5/12 ; B05D1/32 ; B05D3/10
摘要：
A selective metallization process particularly suited for making printed circuit boards comprises the step of treating a substrate having a negative mask thereon with a reactant, e.g., acetic acid, which modifies the surface of the mask without affecting the substrate so as to remove or prevent an active catalytic layer from remaining on the surface of the mask thereby preventing electroless plating on the mask.
公开/授权文献
- US5639580A Reflective integral image element 公开/授权日：1997-06-17
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