The self-bonding enameled wire has an electric insulation layer coated thereon and a bonding layer coated over the insulation layer. The bonding layer is prepared with a mixture including: (a) 100 parts by weight of a phenoxy resin and/or an epoxy resin, both the resins containing not larger than 5 ppm of sodium chloride and having a limiting viscosity of not less than 0.440 as measured in tetrahydrofuran solvent at 25.degree. C.; and (b) 20 to 100 weight parts of a n-butylated melamine resin. In place of this n-butylated melamine resin, there is, according to another aspect of the present invention, used 20 to 50 parts by weight of a mixture of a stabilized polyisocyanate and one of a n-butylated melamine resin and a benzoguanamine resin is used. These self-bonding enameled wire are excellent in refrigerant resistance and may be suitably used for windings of a stator coil in hermetic compressor motors.