发明授权
- 专利标题: Thin film integrated device
- 专利标题(中): 薄膜集成器件
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申请号: US678547申请日: 1984-11-27
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公开(公告)号: US4602192A公开(公告)日: 1986-07-22
- 发明人: Koji Nomura , Hisahito Ogawa , Atsushi Abe , Tsuneharu Nitta
- 申请人: Koji Nomura , Hisahito Ogawa , Atsushi Abe , Tsuneharu Nitta
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX58-57552 19830331; JPX58-98343 19830602
- 主分类号: H01B3/12
- IPC分类号: H01B3/12 ; H01G4/10 ; H01L21/314 ; H01L21/316 ; H01L27/13 ; H01L29/49 ; H01L29/51 ; H01L29/786 ; H05B33/22 ; G09G3/10
摘要:
In a thin film integrated device wherein thin film elements, such as thin film condensers, thin film field effect type transistors and thin film electroluminescent elements, which include insulating films (3, 7, 13, 15, 16) as one of their constitution elements, are formed on an insulating substrate; the insulating films are made of sputtered composite oxide films with at least tantalum and aluminum as major constituents. Since this sputtered composite oxide film has characteristics with a large dielectric constant and a breakdown field intensity and a small leakage current, if it is applied in the thin film elements, their operation characteristics can be increased and their reliability can be remarkably improved.
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