发明授权
- 专利标题： Integrated circuit package incorporating low-stress omnidirectional heat sink
- 专利标题（中）： 集成电路封装结合了低应力全向散热器
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申请号： US754686申请日： 1985-07-15
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公开(公告)号： US4611238A公开(公告)日： 1986-09-09
- 发明人: Terrence E. Lewis , Stephen A. Smiley , Rex Rice , Zeev Lipkes , John A. Nelson
- 申请人： Terrence E. Lewis , Stephen A. Smiley , Rex Rice , Zeev Lipkes , John A. Nelson
- 申请人地址： MI Detroit
- 专利权人： Burroughs Corporation
- 当前专利权人： Burroughs Corporation
- 当前专利权人地址： MI Detroit
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H01L23/40 ; H01L23/36
摘要：
Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is convex for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.
公开/授权文献
- USD329929S Diaper container 公开/授权日：1992-09-29
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