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    Electro-mechanical assembly of high power and low power IC packages with a shared heat sink
    2.
    发明授权
    Electro-mechanical assembly of high power and low power IC packages with a shared heat sink 失效
    具有共用散热器的大功率和低功率IC封装的机电组装

    公开(公告)号：US5424580A

    公开(公告)日：1995-06-13

    申请号：US145932

    申请日：1993-11-01

    申请人： Jerry I. Tustaniwskyj ,  Stephen A. Smiley

    发明人： Jerry I. Tustaniwskyj ,  Stephen A. Smiley

    IPC分类号： H01L23/367 ,  H01L25/10 ,  H01L23/02

    CPC分类号： H01L23/367 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2924/0002

    摘要： An electro-mechanical assembly includes a high power IC package and a low power IC package which are mounted with a space between them on a single substrate. Both of these IC packages have flat top surfaces which dissipate heat; and due to various manufacturing tolerances, those surfaces are non-coplanar with respect to each other. To cool these two IC packages, a single heat sink is provided which has a thin flat core that overlies both of the IC packages as well as the space between them, and cooling fins extend from the top of the core. A pair of contact regions are provided on the bottom of the core which respectively are supported by the flat surfaces of the IC packages; and the contact region for the high power IC package is a projection from the core which is a) substantially smaller in average cross-sectional area, parallel to the core, than the flat surface of the high power IC package, b) aligned with a high power chip in the high power IC package, and c) long enough to prevent any portion of the core from touching the flat surface of the high power IC package, despite its non-coplanarity.

    摘要翻译： 机电组件包括大功率IC封装和低功率IC封装，其在单个基板上安装有它们之间的空间。 这两个IC封装均具有平坦的顶表面，其散热; 并且由于各种制造公差，这些表面相对于彼此是非共面的。 为了冷却这两个IC封装，提供了单个散热器，其具有覆盖两个IC封装之间的薄扁平芯以及它们之间的空间，并且散热片从芯的顶部延伸。 一对接触区设置在芯的底部，分别由IC封装的平坦表面支撑; 并且用于高功率IC封装的接触区域是来自芯体的突出部分，其比a）与大功率IC封装的平坦表面相比平均截面面积的平均截面积大得多，b）与 高功率IC封装中的大功率芯片，以及c）尽管其非共面性，c足够长以防止芯部的任何部分接触高功率IC封装的平坦表面。

    Electromechanical module with post-solder attachable/removable heat sink frame and low profile
    3.
    发明授权
    Electromechanical module with post-solder attachable/removable heat sink frame and low profile 失效
    机电模块，具有后焊料可附接/可拆卸散热器框架和薄型

    公开(公告)号：US5579205A

    公开(公告)日：1996-11-26

    申请号：US519956

    申请日：1995-08-28

    申请人： Jerry I. Tustaniwskyj ,  Stephen A. Smiley

    发明人： Jerry I. Tustaniwskyj ,  Stephen A. Smiley

    IPC分类号： H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44769

    摘要： An electromechanical module comprises an IC package having a top surface which dissipates heat and a heat sink which is held by a frame in direct thermal contact with the top surface. This frame includes a pair of spaced-apart elongated beams and a pair of end members which connect to opposite ends of the beams; and the beams together with the end members surround the IC package and expose all of the top surface. Thus, the heat sink can be in direct thermal contact with all of the top surface and can extend past it without having to step up to get over the frame. To attach/remove the frame from the IC package, each end member has at least one leg with a lip that catches on the bottom surface of the IC package; and, when the beams are manually bowed, the lips on the legs move further apart and past the bottom surface.

    摘要翻译： 机电模块包括具有散热的顶表面和由与顶表面直接热接触的框架保持的散热器的IC封装。 该框架包括一对间隔开的细长梁和连接到梁的相对端的一对端构件; 并且梁与端部构件一起围绕IC封装并暴露所有顶部表面。 因此，散热器可以与所有顶部表面直接热接触，并且可以延伸通过它，而不必加强以超过框架。 为了从IC封装件附接/移除框架，每个端部构件具有至少一个具有唇缘的支脚，该支脚卡在IC封装的底表面上; 并且当手臂弯曲时，腿上的嘴唇进一步分开并经过底面。