公开(公告)号：US4611238A

公开(公告)日：1986-09-09

申请号：US754686

申请日：1985-07-15

申请人： Terrence E. Lewis ,  Stephen A. Smiley ,  Rex Rice ,  Zeev Lipkes ,  John A. Nelson

发明人： Terrence E. Lewis ,  Stephen A. Smiley ,  Rex Rice ,  Zeev Lipkes ,  John A. Nelson

IPC分类号： H01L23/367 ,  H01L23/40 ,  H01L23/36

CPC分类号： H01L23/4006 ,  H01L23/3672 ,  H01L2023/405 ,  H01L2224/48091 ,  H01L2224/48472

摘要： Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is convex for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.

摘要翻译： 公开了一种用于冷却集成电路封装的散热器。 散热器包括具有两个相对主要表面的单个薄片材料。 这两个主表面具有共同的周边，其限定从片材的中心部分径向延伸的薄片材料片的多个间隔开的指形部分。 中心部分是凸的，用于连接到集成电路封装; 并且指形部分形成为延伸出中心部分的平面，成为中心部分的冷却片。

公开(公告)号：US4139859A

公开(公告)日：1979-02-13

申请号：US741747

申请日：1976-11-15

申请人： Terrence E. Lewis ,  Kenneth N. Abel

发明人： Terrence E. Lewis ,  Kenneth N. Abel

IPC分类号： H01L21/50 ,  H01L23/047 ,  H01L23/10 ,  H01L23/14 ,  H01L23/36 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/10 ,  H01L21/50 ,  H01L23/047 ,  H01L23/145 ,  H01L23/36 ,  H01L23/49541 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152

摘要： A semiconductor device package and a method of making it. A woven fiber mat impregnated with an epoxy adhesive serves as a first housing member. It includes an opening therein for receiving a semiconductor device. The housing member is placed on a supporting heat sink and a lead frame placed on top of the housing member. This subassembly is heated to bond the elements together by curing the epoxy adhesive in the first housing member. A similar second housing member is then placed over the lead frame. The second housing member includes an opening therein which is slightly larger than the opening in the first housing member. A lid is placed on top of the second housing member to cover the opening after the semiconductor device has been bonded to the substrate within the openings in the housing members. The assembly is then again heated to bond the remaining elements together with the epoxy adhesive in the second housing member to form a completed package.

公开(公告)号：US3999285A

公开(公告)日：1976-12-28

申请号：US591286

申请日：1975-06-30

申请人： Terrence E. Lewis ,  Kenneth N. Abel

发明人： Terrence E. Lewis ,  Kenneth N. Abel

IPC分类号： H01L21/50 ,  H01L23/047 ,  H01L23/10 ,  B01J17/00

CPC分类号： H01L23/047 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  Y10T29/49121

摘要： A semiconductor device package and a method of making it. A woven fiber mat impregnated with an epoxy adhesive serves as a first housing member. It includes an opening therein for receiving a semiconductor device. The housing member is placed on a supporting heat sink and a lead frame placed on top of the housing member. This subassembly is heated to bond the elements together by curing the epoxy adhesive in the first housing member. A similar second housing member is then placed over the lead frame. The second housing member includes an opening therein which is slightly larger than the opening in the first housing member. A lid is placed on top of the second housing member to cover the opening after the semiconductor device has been bonded to the substrate within the openings in the housing members. The assembly is then again heated to bond the remaining elements together with the epoxy adhesive in the second housing member to form a completed package.

摘要翻译： 半导体器件封装及其制造方法。 用环氧树脂粘合剂浸渍的编织纤维垫用作第一壳体构件。 它包括用于接收半导体器件的开口。 壳体构件放置在支撑散热器和放置在壳体构件顶部上的引线框架上。 该组件被加热以通过固化第一壳体构件中的环氧粘合剂将元件结合在一起。 然后将类似的第二壳体构件放置在引线框架上。 第二壳体构件包括其中比第一壳体构件中的开口略大的开口。 在半导体器件已经在壳体部件的开口内的基板上结合到基板之后，盖子被放置在第二壳体部件的顶部上以覆盖开口。 然后再次加热组件以将其余元件与环氧粘合剂粘合在第二壳体构件中以形成完整的包装。