发明授权
US4672739A Method for use in brazing an interconnect pin to a metallization pattern
situated on a brittle dielectric substrate
失效
用于将互连针钎焊到位于脆性电介质基底上的金属化图案的方法
- 专利标题： Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
- 专利标题（中）： 用于将互连针钎焊到位于脆性电介质基底上的金属化图案的方法
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申请号： US721885申请日： 1985-04-11
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公开(公告)号： US4672739A公开(公告)日： 1987-06-16
- 发明人: Robert W. Churchwell , Philip L. Flaitz , James N. Humenik
- 申请人： Robert W. Churchwell , Philip L. Flaitz , James N. Humenik
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L21/48 ; H01R12/04 ; H05K3/34 ; H01L21/88
摘要：
A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.
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