发明授权
- 专利标题: Multi-layer semiconductor processing with scavenging between layers by excimer laser
- 专利标题(中): 多层半导体处理通过准分子激光在层间清除
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申请号: US736934申请日: 1985-05-22
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公开(公告)号: US4685976A公开(公告)日: 1987-08-11
- 发明人: Steven R. Schachameyer , James A. Benjamin , John B. Pardee , Lyle O. Hoppie
- 申请人: Steven R. Schachameyer , James A. Benjamin , John B. Pardee , Lyle O. Hoppie
- 申请人地址: OH Cleveland
- 专利权人: Eaton Corporation
- 当前专利权人: Eaton Corporation
- 当前专利权人地址: OH Cleveland
- 主分类号: C23C16/02
- IPC分类号: C23C16/02 ; C23C16/48 ; H01L21/268 ; H01L21/265 ; B05D5/12
摘要:
A semiconductor processing technique is disclosed for forming a multi-layered semiconductor structure in a single chamber and with the same equipment, without removing the semiconductor wafer substrate or otherwise transferring it to another chamber. A gaseous mixture of different gases is provided in a chamber. Excimer pulsed ultraviolet laser radiation is introduced into the chamber at a first discrete wavelength to photolytically react with a first of the gases at a discrete excitation energy photochemically breaking bonds of the first gas to epitaxially deposit a first layer on the substrate, followed by radiation at a second discrete wavelength to photolytically react with a second gas to deposit a second layer on the first layer, and so on. The different gases may be introduced into the chamber collectively, or serially between radiations. Scavenging between layers is provided by photolytic removal of surface containments and the products of reaction.
公开/授权文献
- US6015040A Transfer device 公开/授权日:2000-01-18
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