发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US6347申请日： 1987-01-14
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公开(公告)号： US4724472A公开(公告)日： 1988-02-09
- 发明人: Masahiro Sugimoto , Tetsushi Wakabayashi , Kiyoshi Muratake
- 申请人： Masahiro Sugimoto , Tetsushi Wakabayashi , Kiyoshi Muratake
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX58-025858 19830217
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/057 ; H01L23/498 ; H01L23/538 ; H05K3/34 ; H01L23/02
摘要：
A semiconductor device to be mounted on a circuit board, including a semiconductor chip, a package for mounting the semiconductor chip, a plurality of conductor pads provided on the outer surface of the package, and a plurality of conductor pins, connected to the conductor pads in a substantially vertical contact condition, for connecting to the circuit board in accordance with a contacting condition.
公开/授权文献
- US5977697A Field emission devices employing diamond particle emitters 公开/授权日：1999-11-02
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