发明授权
US4745166A Heat-curable mixture containing substituted bicyclo (2.2.1)
hept-5-ene-2,3-dicarboximide and polymaleimide, and ethylenically
unsaturated phenolic compound
失效
含有取代的双环（2.2.1）庚-5-烯-2,3-二羧酰亚胺和聚马来酰亚胺和烯属不饱和酚化合物的可热固化混合物
- 专利标题： Heat-curable mixture containing substituted bicyclo (2.2.1) hept-5-ene-2,3-dicarboximide and polymaleimide, and ethylenically unsaturated phenolic compound
- 专利标题（中）： 含有取代的双环（2.2.1）庚-5-烯-2,3-二羧酰亚胺和聚马来酰亚胺和烯属不饱和酚化合物的可热固化混合物
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申请号： US26083申请日： 1987-03-16
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公开(公告)号： US4745166A公开(公告)日： 1988-05-17
- 发明人: Alfred Renner , Sameer H. Eldin
- 申请人： Alfred Renner , Sameer H. Eldin
- 申请人地址： NY Ardsley
- 专利权人： Ciba-Geigy Corporation
- 当前专利权人： Ciba-Geigy Corporation
- 当前专利权人地址： NY Ardsley
- 优先权： CHX4389/84 19840914
- 主分类号： C08F20/00
- IPC分类号： C08F20/00 ; C08F20/52 ; C08F22/36 ; C08F26/00 ; C08F26/06 ; C08F222/40 ; C08F226/06 ; C08G73/12 ; C09D4/00 ; C09D133/04 ; C09D135/00 ; C09J4/02 ; C09J133/02 ; C09J135/00
摘要：
Heat-curable mixtures comprising(a) 10-90% by weight of at least one compound of formula I ##STR1## (b) 90-10% by weight of at least one compound of formula II ##STR2## and, based on the sum of (a)+(b), (c) 0-30% by weight of at least one compound which is able to react with component (b),in which formulae above n, m, R, R', R.sub.1, R.sub.2 and R.sub.3 are as define in claim 1, are suitable for the preparation of moulded articles such as prepregs and composites, coatings and bonds.
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