发明授权
- 专利标题： Pattern position detecting method and apparatus for detecting the position of an alignment direction of a wafer target pattern
- 专利标题（中）： 用于检测晶片靶图案的取向方向的位置的图案位置检测方法和装置
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申请号： US868601申请日： 1986-05-30
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公开(公告)号： US4777374A公开(公告)日： 1988-10-11
- 发明人: Toshihiko Nakata , Yoshitada Oshida , Masataka Shiba
- 申请人： Toshihiko Nakata , Yoshitada Oshida , Masataka Shiba
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX60-118969 19850603
- 主分类号： H01L21/30
- IPC分类号： H01L21/30 ; G03F9/00 ; H01L21/027 ; H01L21/66 ; H01L21/67 ; H01L21/68 ; G01N21/86
摘要：
A pattern position detecting method and an apparatus comprises spatial coherence variable means for illuminating a two-dimensional pattern formed on a wafer and its vicinity through a projection lens under the state that spatial coherence of pattern illumination light is elevated in one direction with respect to said two-dimensional pattern and lowered in the other direction perpendicular to said one direction. Two-dimensional reflection images from the pattern and its vicinity obtained through the lens are image-formed by an image-formation optical system. The intensity distribution of the two-dimensional reflection light is detected by light-intensity-distribution detection means so that a detection signal produced from this detection means indicates the position of the two-dimensional pattern.
公开/授权文献
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