摘要:
A reduction projection type aligner in a reduction projection exposing device for exposing a circuit pattern on a mask through a reduction projection lens onto a wafer by the step and repeat of the wafer, which comprises: a light source for irradiating coherent irradiation light, a reflection mirror for reflecting the coherent irradiation light irradiated from the light source, a detection optical system for detecting an interference pattern by optically causing interference between an alignment pattern reflection light obtained by entering the coherent irradiation light irradiated from the light source through the reduction projection lens to the alignment pattern portion of the wafer, which is then reflected at the alignment pattern portion and then passed through the reduction projection lens and a reflection light reflected at the reflection mirror, and means for aligning a mask and a wafer relatively by detecting the position of the wafer by the video image signals in the interference pattern detected by the detection optical system.
摘要:
An exposure apparatus comprises a light source, a mask plate having an exposure pattern area section and an alignment/reflection area section, a projection lens, a movable stage for holding a workpiece having a workpiece alignment mark, an alignment control and a driver for the movable stage. Before the exposure pattern area section is illuminated by the light source to be projected through the projection lens onto the workpiece, the workpiece is properly aligned with the mask. Alignment between the mask plate and the workpiece is performed by the effective use of the alignment/reflection area section specifically arranged and having a specific structure. The alignment/reflection area section is on that surface of the mask plate which does not face the light source and includes a reflection portion for conducting light from another light source to the workpiece and conducting light scattered from the workpiece and passing through the projection lens to the alignment control and a mask alignment mark portion of providing, when illuminated, an image of the mask alignment mark portion to the alignment control so that it detects the positional relation between the mask alignment mark portion and the workpiece alignment mark and produces a control signal for achieving alignment between the mask plate and the workpiece.
摘要:
An alignment method and apparatus for reduction projection type aligner in which the rough detection of reticle position in the reticle alignment process at the time of mounting a reticle and the fine detection of reticle position in the wafer alignment for the alignment between a wafer and the reticle are performed automatically by the same reticle alignment pattern and the same optical alignment detection system. A plurality of one- or two-dimensional Fresnel zone plates having different shapes of diffraction patterns formed outside of a reticle circuit pattern and arranged at a position outward of the entrance pupil of the reduction projection lens are used as a reticle alignment pattern to detect the absolute position of the reticle. The detection field of view of the optical alignment detection system is thus effectively widened to make pattern detection possible with high magnification for an improved detection accuracy. The same reticle alignment pattern and the same optical alignment detection system are used for rough detection of reticle position in reticle alignment and fine detection of reticle position in wafer alignment. In the optical alignment detection system, on the other hand, the image position of the diffraction pattern from the reticle alignment pattern and the image position of the wafer alignment pattern are located at the same distance from the reticle surface.
摘要:
A pattern position detecting method and an apparatus comprises spatial coherence variable means for illuminating a two-dimensional pattern formed on a wafer and its vicinity through a projection lens under the state that spatial coherence of pattern illumination light is elevated in one direction with respect to said two-dimensional pattern and lowered in the other direction perpendicular to said one direction. Two-dimensional reflection images from the pattern and its vicinity obtained through the lens are image-formed by an image-formation optical system. The intensity distribution of the two-dimensional reflection light is detected by light-intensity-distribution detection means so that a detection signal produced from this detection means indicates the position of the two-dimensional pattern.
摘要:
A semiconductor focusing exposure apparatus in which an opposite face of a mask to a face to be illuminated by exposure light is illuminated with alignment light so that the light reflected from said opposite face may be used for alignment and which is equipped with a second moving arrangement which is separate from a moving arrangement for an x-y moving table supporting a wafer, for aligning the mask and the wafer in an orthogonal direction with respect to the optical axis of a focusing lens.Moreover, the center of the flux of alignment pattern light for illuminating the wafer is made incident upon a line of intersection on which a plane containing the optical axis of an alignment optical system and the optical axis of said focusing lens and the incident plane of said focusing lens intersect with each other.Still moreover, the optical path of the alignment light beam is aligned in parallel with a straight line joining an alignment mark formed on the diffraction pattern and the center of the entrance pupil of said focusing lens.
摘要:
A production method of a semiconductor device, includes the steps of emitting an excimer laser from a light source, forming the excimer laser in a particular shape, illuminating a pattern on a mask for a phase shifter method with the particular shaped excimer laser, and exposing a resist on a wafer with the excimer laser which passed through the mask. The resist on the wafer is developed and the wafer is etched to form a pattern.
摘要:
A production method of a semiconductor device, includes the steps of emitting an excimer laser from a light source, illuminating a pattern on a mask with the excimer laser emitted from the light source and passed through a filter, exposing a resist on a substrate of the semiconductor with the excimer laser passed through the mask, and forming a pattern on the substrate in accordance with a portion of the resist exposed with the excimer laser.
摘要:
A novel exposure system includes a reduced-projection lens optimized for a predetermined single exposure wavelength and a chromatic aberration correction system for TTL (Through The Lens) alignment with broadband light. The correction system includes a holographic lens which dispersion has a negative number in contrast to a conventional glass lens which has a positive dispersion number. By employing a holographic lens, the total optical length of an alignment system can be made short enough to avoid the necessity of installing a mirror therein, thus realizing a highly accurate alignment system.
摘要:
A plurality of substrate assemblies each including a substrate such as a reticle or photomask used for exposure and frames, mounted to the opposite surfaces of the substrate, to which foreign particle deposition preventive films are applied are stored in a magazine. By using a transport unit, a substrate assembly is taken out of the magazine, transported from the magazine to a mask table disposed at an exposure position and set at the mask table. A foreign particle detector is provided near the transport unit to optically detect foreign particles present on the foreign particle deposition preventive film of the substrate assembly. The substrate assembly set at the mask table is aligned to a wafer. A light beam is irradiated on the substrate assembly aligned relative to the wafer and a circuit pattern formed on the substrate is projected upon the wafer through a projection optical system to expose the wafer to the light beam through the circuit pattern.
摘要:
A production method of a semiconductor device which includes the steps of exposing a resist coated on a substrate of a semiconductor device by projecting a light pattern on the substrate of the semiconductor device through an object lens, developing the resist exposed by the light pattern to form a wafer pattern with the resist, and etching the substrate on which the wafer pattern with the resist is formed. In the step of exposing, the light pattern projected on the substrate is formed by excimer laser light which is emitted from an annular shaped light source and which is passed through a mask having a phase shifter.