发明授权
- 专利标题： Method of taking out lead of semiconductor tip part
- 专利标题（中）： 取出半导体尖端部分的铅的方法
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申请号： US196139申请日： 1988-05-19
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公开(公告)号： US4850105A公开(公告)日： 1989-07-25
- 发明人: Kazuo Nakajima , Katsuhiko Tomita
- 申请人： Kazuo Nakajima , Katsuhiko Tomita
- 申请人地址： JPX Kyoto
- 专利权人： Horiba, Ltd.
- 当前专利权人： Horiba, Ltd.
- 当前专利权人地址： JPX Kyoto
- 优先权： JPX62-168378 19870704
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; G01N27/403 ; H01L21/56 ; H01L21/60 ; H01L21/68 ; H01L23/057 ; H01L23/14 ; H01L23/31 ; H01L23/498 ; H01L23/50
摘要：
A method of removing a lead from a semiconductor tip part is provided by inserting the tip part in a through hole of a substrate. The tip part is equalized in height with substrate by adhering an adhesive tape across the through hole. A gap is left between the tip part and through hole which is filled with an insulative resin. If the substrate already has electrically conductive portions on it, a conductive paste is printed on the substrate between conductive portions and the tip part. If the substrate does not already have them, the conductive portions are formed by the addition of conductive paste on the substrate and which extends to the tip part.
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