发明授权
US4855251A Method of manufacturing electronic parts including transfer of bumps of
larger particle sizes
失效
制造电子部件的方法，包括较大粒度的凸块的转印
- 专利标题： Method of manufacturing electronic parts including transfer of bumps of larger particle sizes
- 专利标题（中）： 制造电子部件的方法，包括较大粒度的凸块的转印
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申请号： US267707申请日： 1988-11-03
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公开(公告)号： US4855251A公开(公告)日： 1989-08-08
- 发明人: Kiyoshi Iyogi , Koji Yamakawa , Nobuo Iwase
- 申请人： Kiyoshi Iyogi , Koji Yamakawa , Nobuo Iwase
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX61-150445 19860626
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/485
摘要：
According to the present invention, a method is provided of manufacturing electronic parts, comprising a first step of forming on the surface of a substrate a bump wherein the metal particles of that portion of the bump which contacts the surface of the substrate have a larger diameter than the metal particles of that portion of the bump which does not contact the surface of the substrate, a second step of transferring the bump to an electrode lead, and a third step of connecting an electrode lead to a predetermined electrode section of the semiconductor chip, by means of the transferred bump. The method of the present invention ensures that the bump does not fall off during the electroplating and washing steps, and ensures a high-strength bond between the transferred bump and the electrode section of a semiconductor chip.
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