发明授权
US4893168A Semiconductor integrated circuit device including bonding pads and
fabricating method thereof
失效
包括接合焊盘的半导体集成电路器件及其制造方法
- 专利标题： Semiconductor integrated circuit device including bonding pads and fabricating method thereof
- 专利标题（中）： 包括接合焊盘的半导体集成电路器件及其制造方法
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申请号： US384680申请日： 1982-06-02
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公开(公告)号： US4893168A公开(公告)日： 1990-01-09
- 发明人: Yoshikazu Takahashi , Tsuneo Itoh , Makoto Takechi
- 申请人： Yoshikazu Takahashi , Tsuneo Itoh , Makoto Takechi
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi Microcomputer Engineering, Ltd.
- 当前专利权人： Hitachi, Ltd.,Hitachi Microcomputer Engineering, Ltd.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX56-95357 19810622
- 主分类号： H01L21/822
- IPC分类号： H01L21/822 ; H01L21/60 ; H01L21/82 ; H01L27/04 ; H01L27/118 ; H03K19/003 ; H03K19/0185 ; H03K19/173
摘要：
Herein disclosed is a semiconductor integrated circuit device which includes a unit cell for forming such an input/output circuit portion as is made capable of selecting any of a plurality of different input and output functions by changing a wiring pattern. The semiconductor integrated circuit is constructed such that there are formed in a manner to correspond to the unit cell a plurality of bonding pad regions which can be separated from one another so that any of the plural input and output functions can be arbitrarily selected through those bonding pad regions.
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