发明授权
- 专利标题： Semiconductor devices and method of manufacturing the same
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US296324申请日： 1989-01-11
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公开(公告)号： US4949143A公开(公告)日： 1990-08-14
- 发明人: Mamoru Iesaka , Shinji Uya , Nozomu Harada
- 申请人： Mamoru Iesaka , Shinji Uya , Nozomu Harada
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX60-202114 19850912
- 主分类号： H01L27/148
- IPC分类号： H01L27/148 ; H04N5/335 ; H04N5/341 ; H04N5/369 ; H04N5/3728
摘要：
The semiconductor devices include a semiconductor substrate, a first CCD region formed at the surface of said substrate, and a second CCD region having a side connected to said first CCD. A channel region of the first CCD region has a different channel potential at a latter part of the end transfer electrode corresponding to the portion of the first CCD region connected to the second CCD region.
公开/授权文献
- US6108827A Toilet bowl cover 公开/授权日：2000-08-29
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