摘要:
The semiconductor devices include a semiconductor substrate, a first CCD region formed at the surface of said substrate, and a second CCD region having a side connected to said first CCD. A channel region of the first CCD region has a different channel potential at a latter part of the end transfer electrode corresponding to the portion of the first CCD region connected to the second CCD region.
摘要:
In a CCD image sensor, a plurality of horizontal CCD registers are disposed adjacent to an image sensing area having matrix-arrayed image sensing cells and a plurality of vertical CCD registers. In the CCD image sensor, the channel impurity concentration of second horizontal CCD register, located away from the image sensing area, is more higher than that of first horizontal CCD register. With this feature, when the charges are transferred to the second horizontal CCD register across the first horizontal register, the residual charges in the first horiozntal CCD register are remarkably reduced.
摘要:
A solid-state imaging device comprises, on a semiconductor substrate, a plurality of sensor sections for storing a signal charge commensurate with a quantity of reception light, a charge transfer section for transferring and outputting the signal charge of the sensor sections, and an output section for converting the signal charge transferred by the charge transfer section into an imaging signal for output. A current controller is provided to cut off or reduce a current flowing to the output section in a signal storage period of the sensor section. This cuts off or reduces the current flowing to the output section in a signal storage period of the sensor section, and hence suppresses the amount of the current flowing to the output section in the signal storage period. Thus, wasteful consumption power is greatly reduced.
摘要:
A solid-state imaging device of the present invention is capable of thinning signals for each column. The solid-state imaging device includes: photo diodes, a drain into which charges transferred by first column CCDs are swept-off, and transfer control units each of which is provided to the corresponding first column CCDs, and transfers, to a row CCD and to the drain, the charges transferred by the corresponding first column CCDs. Each of the transfer control units includes: a second column CCD which transfers, in a column direction, the charges transferred by the first column CCDs corresponding to the transfer control unit, and a column CCD terminal gate which is provided between the second column CCD and the row CCD, and forms a potential barrier between the second column CCD and the row CCD.
摘要:
A solid-state image pickup device (1) comprises: an image sensor wafer (2A) including image sensors (3); an optically-transparent protection member (4) connected by use of an adhesive agent (7) via a spacer (5) arranged to surround the image sensors (3); and an electrostatic (ESD) protection circuit (10) disposed on the image sensor wafer (2A) so as to avoid a position corresponding to a connected surface where the spacer (5) and the image sensor wafer (2A) are connected. Accordingly, in this configuration, even when polarization occurs in the adhesive agent, since the p-well layer between diffusion layers of the ESD protection circuit is not disposed immediately below the connected surface, the p-well layer is not inverted by electric charges in the element interface and thus parasitic MOS transistor does not turn on, allowing suppression of leak current.
摘要:
An output amplifier for a solid-state imaging device is provided and includes: a floating diffusion that stores a signal charge; and at least three source follower circuits that output a signal in accordance with a change of a potential on the floating diffusion, the at least three source follower circuits being sequentially connected in decreasing order of drain voltage from a first circuit of the at least three source follower circuits to a last circuit of the at least three source follower circuits.
摘要:
A solid-state image sensor (1) includes: an imaging device wafer (2A); a plurality of imaging devices (3) which are formed on the imaging device wafer (2A); a spacer (5) which surrounds the imaging devices (3) on the imaging device wafer (2A) and is joined to the imaging device wafer (2A) with an adhesive (7); a transparent protection member (4) which covers the imaging devices (3) on the imaging device wafer (2A) and is attached on the spacer (5); and a plurality of electrostatic discharge protection devices (10A) which are formed on the imaging device wafer (2A), the electrostatic discharge protection devices (10A) being positioned under the spacer (5), each of the electrostatic discharge protection devices (10A) having diffusion layers (12, 13) and a well layer (11) between the diffusion layers (12, 13), the well layer (11) being provided with a channel stopper (20).
摘要:
A solid-state imaging device comprises, on a semiconductor substrate, a plurality of sensor sections for storing a signal charge commensurate with a quantity of reception light, a charge transfer section for transferring and outputting the signal charge of the sensor sections, and an output section for converting the signal charge transferred by the charge transfer section into an imaging signal for output. A current controller is provided to cut off or reduce a current flowing to the output section in a signal storage period of the sensor section. This cuts off or reduces the current flowing to the output section in a signal storage period of the sensor section, and hence suppresses the amount of the current flowing to the output section in the signal storage period. Thus, wasteful consumption power is greatly reduced.
摘要:
A solid-state image sensor (1) includes: an imaging device wafer (2A); a plurality of imaging devices (3) which are formed on the imaging device wafer (2A); a spacer (5) which surrounds the imaging devices (3) on the imaging device wafer (2A) and is joined to the imaging device wafer (2A) with an adhesive (7); a transparent protection member (4) which covers the imaging devices (3) on the imaging device wafer (2A) and is attached on the spacer (5); and a plurality of electrostatic discharge protection devices (10A) which are formed on the imaging device wafer (2A), the electrostatic discharge protection devices (10A) being positioned under the spacer (5), each of the electrostatic discharge protection devices (10A) having diffusion layers (12, 13) and a well layer (11) between the diffusion layers (12, 13), the well layer (11) being provided with a channel stopper (20).
摘要:
A solid-state imaging device comprises, on a semiconductor substrate, a plurality of sensor sections for storing a signal charge commensurate with a quantity of reception light, a charge transfer section for transferring and outputting the signal charge of the sensor sections, and an output section for converting the signal charge transferred by the charge transfer section into an imaging signal for output. A current controller is provided to cut off or reduce a current flowing to the output section in a signal storage period of the sensor section. This cuts off or reduces the current flowing to the output section in a signal storage period of the sensor section, and hence suppresses the amount of the current flowing to the output section in the signal storage period. Thus, wasteful consumption power is greatly reduced.