发明授权
US5001542A Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips 失效
用于电路连接的组合,使用其的连接方法以及半导体芯片的连接结构

Composition for circuit connection, method for connection using the
same, and connected structure of semiconductor chips
摘要:
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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