发明授权
US5001542A Composition for circuit connection, method for connection using the
same, and connected structure of semiconductor chips
失效
用于电路连接的组合,使用其的连接方法以及半导体芯片的连接结构
- 专利标题: Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
- 专利标题(中): 用于电路连接的组合,使用其的连接方法以及半导体芯片的连接结构
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申请号: US443169申请日: 1989-11-30
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公开(公告)号: US5001542A公开(公告)日: 1991-03-19
- 发明人: Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
- 申请人: Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yasushi Goto
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi Chemical Company
- 当前专利权人: Hitachi Chemical Company
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX63-307618 19881205; JPX01-005540 19890112; JPX01-005541 19890112; JPX01-069973 19890322
- 主分类号: H01R4/04
- IPC分类号: H01R4/04 ; C09J163/00 ; G06K19/077 ; H01B1/00 ; H01B1/20 ; H01L21/52 ; H01L21/56 ; H01L21/60 ; H01L23/482 ; H01L23/498 ; H05K3/32
摘要:
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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