公开(公告)号：US5120665A

公开(公告)日：1992-06-09

申请号：US671472

申请日：1991-03-19

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US5155906A

公开(公告)日：1992-10-20

申请号：US672110

申请日：1991-03-19

申请人： Yasushi Goto ,  Atsuo Nakajima ,  Isao Tsukagoshi ,  Tomohisa Ohta ,  Yutaka Yamaguchi

发明人： Yasushi Goto ,  Atsuo Nakajima ,  Isao Tsukagoshi ,  Tomohisa Ohta ,  Yutaka Yamaguchi

IPC分类号： H01R43/00 ,  H05K3/22 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

CPC分类号： H05K3/225 ,  H05K3/288 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/176 ,  H05K3/321 ,  H05K3/361 ,  Y10T29/49155 ,  Y10T29/49721

摘要： Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.

公开(公告)号：US6113728A

公开(公告)日：2000-09-05

申请号：US464118

申请日：1995-06-05

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  B32B31/00 ,  C09J5/10

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321 ,  Y10T156/1075 ,  Y10T29/4913

摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

摘要翻译： 一种粘合膜，其包含（a）液体环氧树脂，（b）具有一个或多个官能团的固体树脂，（c）微胶囊型固化剂，并且如果需要（d）偶联剂，对于连接半导体芯片是有效的 和加热和压力下的接线板。

公开(公告)号：US5843251A

公开(公告)日：1998-12-01

申请号：US853868

申请日：1992-03-20

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/482 ,  H05K3/32 ,  B32B31/00

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321 ,  Y10T156/1075 ,  Y10T29/4913

摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.

公开(公告)号：US5001542A

公开(公告)日：1991-03-19

申请号：US443169

申请日：1989-11-30

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yasushi Goto

IPC分类号： H01R4/04 ,  C09J163/00 ,  G06K19/077 ,  H01B1/00 ,  H01B1/20 ,  H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/482 ,  H01L23/498 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L23/49883 ,  H01L24/05 ,  H01L24/29 ,  H05K3/323 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/82365 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/15151 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  H05K3/321

摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

公开(公告)号：US4740657A

公开(公告)日：1988-04-26

申请号：US13904

申请日：1987-02-12

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Atsuo Nakajima ,  Yoshikatsu Mikami ,  Kuniteru Muto ,  Yoshiyuki Ikezoe

IPC分类号： H01B1/22 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  H01B1/16 ,  H01R43/00

CPC分类号： H01R4/04 ,  H01B1/22 ,  H05K3/323 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  H05K3/361 ,  Y10T29/49194

摘要： Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.

公开(公告)号：US4731282A

公开(公告)日：1988-03-15

申请号：US854808

申请日：1986-04-23

申请人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Tadamitsu Nakayama

发明人： Isao Tsukagoshi ,  Yutaka Yamaguchi ,  Tadamitsu Nakayama

IPC分类号： H01L23/498 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B32B5/16 ,  C09J7/02

CPC分类号： H01L23/49883 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/83101 ,  H01L2924/0002 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0266 ,  H05K3/361 ,  Y10S428/929 ,  Y10T428/23943 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/28

摘要： An anisotropic-electroconductive adhesive film containing a small quantity of electroconductive particles having a special shape in an adhesive component layer which has a limited thickness is useful for connecting micro-sized circuits, etc. due to its anisotropy in electroconductivity and good transparency.

摘要翻译： 含有少量导电粒子的各向异性导电粘合剂薄膜，由于其导电性的各向异性和良好的透明性而用于连接微小尺寸的电路等。

公开(公告)号：US09152034B2

公开(公告)日：2015-10-06

申请号：US13330760

申请日：2011-12-20

申请人： Yutaka Yamaguchi

发明人： Yutaka Yamaguchi

IPC分类号： G03B35/26 ,  G02B27/26 ,  G03B21/14 ,  H04N9/31 ,  G02B27/22

CPC分类号： G03B35/26 ,  G02B27/2207 ,  G02B27/2228 ,  G02B27/2264 ,  G02B27/26 ,  G03B21/14 ,  G03B21/2066 ,  G03B21/2073 ,  H04N9/3167

摘要： An image display apparatus includes an image display element configured to modulate incident light from a light source, a polarization splitting element that has characteristics of transmitting first polarized light and reflecting second polarized light different from the first polarized light and that is configured to synthesize image light from the image display element to be introduced into a projection optical system, and a phase difference plate that is disposed at a side of the projection optical system relative to the polarization splitting element. The phase difference plate has an optic axis in a direction different from a surface normal direction and an in-plane direction of the phase difference plate.

摘要翻译： 图像显示装置包括：调制来自光源的入射光的图像显示元件，具有透射第一偏振光并反射与第一偏振光不同的第二偏振光的特性的偏振分离元件，并且被配置为合成图像光 从要被引入投影光学系统的图像显示元件和相对于偏振分离元件设置在投影光学系统的一侧的相位差板。 相位差板具有与相位差板的表面法线方向和面内方向不同的方向的光轴。

公开(公告)号：US08449042B2

公开(公告)日：2013-05-28

申请号：US12805613

申请日：2010-08-10

申请人： Yutaka Yamaguchi ,  Osamu Yamaguchi

发明人： Yutaka Yamaguchi ,  Osamu Yamaguchi

IPC分类号： F16F15/32

CPC分类号： F16F15/328 ,  F16F15/324

摘要： The present invention provides an adhesive wheel balance weight capable of drastically reducing costs from those of conventional ones, and a process for producing the same. In an adhesive wheel balance weight (W) comprising a weight body (P) and an adhesive tape (T) for attaching the weight body (P) to a vehicle wheel, the weight body (P) comprises a folded weight comprising a folded metal plate piece. The folded weight of the present invention can be formed from a relatively inexpensive raw material sheet at a high yield rate. It is preferable that the raw material sheet is a zinc-coated steel sheet, because no rust-proofing aftertreatment is necessary and therefore further cost reduction is achieved, and its environmental burden is small.

摘要翻译： 本发明提供一种能够显着地降低成本与传统轮胎平衡重的粘合轮平衡重及其制造方法。 在包括用于将重量体（P）附接到车轮的重量体（P）和粘合带（T））的粘合轮平衡重（W）中，所述重量体（P）包括折叠重量，所述折叠重量包括折叠金属 板块 本发明的折叠重量可以由相对便宜的原料片以高产率形成。 优选原料片是镀锌钢板，因为不需要防锈后处理，因此进一步降低成本，并且其环境负担小。

公开(公告)号：US08339708B2

公开(公告)日：2012-12-25

申请号：US13456090

申请日：2012-04-25

申请人： Daisuke Sano ,  Yutaka Yamaguchi

发明人： Daisuke Sano ,  Yutaka Yamaguchi

IPC分类号： G02B27/28

CPC分类号： G02B5/3083

摘要： An optical element including a first layer (011) made of a medium having optical anisotropy, wherein a difference between refractive indexes nh and nl (nh>nl) at a central wavelength λ for first and second polarized lights which enter the optical element and whose polarization directions are different from each other is at least 0.1, and wherein conditions (nt1−nl)·(nl−nt2)≦0 and nt1

摘要翻译： 一种光学元件，包括由具有光学各向异性的介质制成的第一层（011），其中进入所述光学元件的第一和第二偏振光的中心波长λ处的折射率nh和nl（nh> nl）之间的差异， 极化方向彼此不同的是至少为0.1，其中条件（nt1-n1）·（nl-nt2）＆nlE; 0和nt1