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1.发明授权Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips 失效用于电路连接的组合，使用其的连接方法以及半导体芯片的连接结构
公开(公告)号：US5001542A
公开(公告)日：1991-03-19
申请号：US443169
申请日：1989-11-30
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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公开(公告)号：US5155906A
公开(公告)日：1992-10-20
申请号：US672110
申请日：1991-03-19
CPC分类号： H05K3/225 , H05K3/288 , H05K2203/0769 , H05K2203/0783 , H05K2203/176 , H05K3/321 , H05K3/361 , Y10T29/49155 , Y10T29/49721
摘要： Circuit connections can be repaired with high accuracy and high reliability by peeling a mutually connected circuit portion to be repaired and placing a porous sheet with predetermined shape on the peeled circuit surface, impregnating the porous sheet with a peeling solution, removing the porous sheet containing unnecessary adhesive dissolved by the peeling solution, while cleaning the circuit surface contacted with the peeling solution, and reconnecting the cleaned circuit surface to a circuit surface to be connected via an adhesive.
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3.发明授权
公开(公告)号：US5120665A
公开(公告)日：1992-06-09
申请号：US671472
申请日：1991-03-19
IPC分类号： H01R4/04 , C09J163/00 , G06K19/077 , H01B1/00 , H01B1/20 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/05 , H01L24/29 , H05K3/323 , H01L2224/0401 , H01L2224/05571 , H01L2224/274 , H01L2224/2919 , H01L2224/29339 , H01L2224/29355 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/82365 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01054 , H01L2924/0106 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/09701 , H01L2924/15151 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321
摘要： A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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公开(公告)号：US6113728A
公开(公告)日：2000-09-05
申请号：US464118
申请日：1995-06-05
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L24/13 , H01L24/29 , H05K3/323 , H01L2224/13019 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321 , Y10T156/1075 , Y10T29/4913
摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
摘要翻译： 一种粘合膜，其包含（a）液体环氧树脂，（b）具有一个或多个官能团的固体树脂，（c）微胶囊型固化剂，并且如果需要（d）偶联剂，对于连接半导体芯片是有效的 和加热和压力下的接线板。
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公开(公告)号：US5843251A
公开(公告)日：1998-12-01
申请号：US853868
申请日：1992-03-20
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L24/13 , H01L24/29 , H05K3/323 , H01L2224/13019 , H01L2224/16225 , H01L2224/274 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83191 , H01L2224/83855 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01054 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/15151 , H01L2924/15788 , H01L2924/1579 , H01L2924/351 , H05K2201/0221 , H05K2201/0233 , H05K2201/10674 , H05K2203/1163 , H05K3/321 , Y10T156/1075 , Y10T29/4913
摘要： An adhesive film comprising (a) a liquid epoxy resin, (b) a solid resin having one or more functional groups, (c) a microcapsule type curing agent, and if necessary (d) a coupling agent, is effective for connecting semiconductor chips and wiring boards under heat and pressure.
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6.发明授权Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained 失效各向异性导电粘合剂组合物，使用其的电路的连接方法以及由此获得的连接的电路结构
公开(公告)号：US4740657A
公开(公告)日：1988-04-26
申请号：US13904
申请日：1987-02-12
申请人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yoshikatsu Mikami , Kuniteru Muto , Yoshiyuki Ikezoe
发明人： Isao Tsukagoshi , Yutaka Yamaguchi , Atsuo Nakajima , Yoshikatsu Mikami , Kuniteru Muto , Yoshiyuki Ikezoe
CPC分类号： H01R4/04 , H01B1/22 , H05K3/323 , H01L2224/293 , H01L2224/29399 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/01019 , H01L2924/01079 , H05K2201/0221 , H05K2201/0233 , H05K2201/068 , H05K3/361 , Y10T29/49194
摘要： Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insulating adhesive component.
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