发明授权
US5023696A Semiconductor device having composite substrate formed by fixing two
semiconductor substrates in close contact with each other
失效
具有通过将两个半导体衬底彼此紧密接合而形成的复合衬底的半导体器件
- 专利标题： Semiconductor device having composite substrate formed by fixing two semiconductor substrates in close contact with each other
- 专利标题（中）： 具有通过将两个半导体衬底彼此紧密接合而形成的复合衬底的半导体器件
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申请号： US305652申请日： 1989-02-03
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公开(公告)号： US5023696A公开(公告)日： 1991-06-11
- 发明人: Masanobu Ogino
- 申请人： Masanobu Ogino
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX63-22803 19880204
- 主分类号： H01L29/68
- IPC分类号： H01L29/68 ; H01L21/18 ; H01L21/322 ; H01L21/331 ; H01L21/332 ; H01L29/32 ; H01L29/739 ; H01L29/74 ; H01L29/749 ; H01L29/78
摘要：
A semiconductor element is formed in a composite substrate constructed by fixing two semiconductor substrates in close contact with each other, and crystal defects are formed in that portion of at least one of the two semiconductor substrates which lies near the junction plane of the two semiconductor substrates. The crystal defects act as the center of the recombination of excess minority carriers accumulated in an active region of the semiconductor element.
公开/授权文献
- US5594776A Efficient paging system 公开/授权日：1997-01-14
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