发明授权
- 专利标题: Method of fabricating a structure having self-aligned diffused junctions
- 专利标题(中): 制造具有自对准扩散结的结构的方法
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申请号: US382879申请日: 1989-07-21
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公开(公告)号: US5026663A公开(公告)日: 1991-06-25
- 发明人: Peter J. Zdebel , Barbara Vasquez
- 申请人: Peter J. Zdebel , Barbara Vasquez
- 申请人地址: IL Schaumburg
- 专利权人: Motorola, Inc.
- 当前专利权人: Motorola, Inc.
- 当前专利权人地址: IL Schaumburg
- 主分类号: H01L29/73
- IPC分类号: H01L29/73 ; H01L21/033 ; H01L21/225 ; H01L21/28 ; H01L21/285 ; H01L21/331 ; H01L21/336 ; H01L29/732 ; H01L29/78
摘要:
A method of fabricating a semiconductor structure having self-aligned diffused junctions is provided wherein a first dielectric layer, a doped semiconductor layer and a second dielectric layer are formed on a semiconductor substrate. An opening extending to the semiconductor substrate is then formed through these layers. Undoped semiconductor spacers are formed in the opening adjacent to the exposed ends of the doped semiconductor layer and dopant is diffused from the doped semiconductor layer through the undoped semiconductor spacers and into the semiconductor substrate to form junctions therein. This provides for integrated contacts through the doped semiconductor layer.
公开/授权文献
- US6145255A Soffit vent 公开/授权日:2000-11-14
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