发明授权
US5047114A Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials 失效
在热塑性基材上生产金属包覆热塑性基材和印刷电路的方法

Process for the production of metal clad thermoplastic base materials
and printed circuits on thermoplastic base materials
摘要:
A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuits from such metal clad thermoplastic polymeric base materials are provided. The invention also includes the articles so produced. Metal clad thermoplastic polymeric base materials are produced by laminating a metal foil or sheet to thermoplastic polymeric base material, under pressure, at a temperature from about 2.degree. C. to about 45.degree. C. above the glass transition temperature (Tg) of the thermoplastic. The polymeric material is free of volatile materials such as moisture or solvents when laminated.
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