A soldering device has two or four stirrup electrodes secured to a soldering stirrup holder and a centrally-arranged suction pipette between the stirrup electrodes for picking up, conveying and placing components onto assigned soldering locations. Sensitive mechanical and electrical parts, particularly machanical guides and electrical contacts are protected against undesired precipitation of soldering vapors that arise during the soldering process. This protection is achieved by an extraction device for solder vapors which includes an annular extraction opening between the suction pipette and the soldering stirrup holder. The extraction opening discharges into an extraction chamber arranged above the soldering stirrup holder and is in communication with at least one extraction port.