A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness, and at the same time the end face of the cylindrical material is ground. In the slicing method according to the invention, the grinding position and the amount of indexing of the cylindrical material can be corrected in accordance with the actually measured data of the thicknesses of the wafer after slicing, the data of axial displacements of the blade detected during slicing, and the actually measured data of the shapes of the end face of the cylindrical material after slicing of the wafer. Thus, the grinding position can be calculated accurately, the loss of the cylindrical material can be minimized, and the slicing can be carried out with an accurate amount of indexing, so that the wafer can be manufactured with high accuracy.