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    METHOD FOR CHAMFERING WAFER
    1.
    发明申请
    METHOD FOR CHAMFERING WAFER 审中-公开
    切割方法

    公开(公告)号：US20120100785A1

    公开(公告)日：2012-04-26

    申请号：US13264635

    申请日：2010-03-30

    申请人： Yukio Ishimasa ,  Ichiro Katayama ,  Tadahiro Kato ,  Kuniaki Oonishi

    发明人： Yukio Ishimasa ,  Ichiro Katayama ,  Tadahiro Kato ,  Kuniaki Oonishi

    IPC分类号： B24B1/00

    CPC分类号： H01L21/02021 ,  B24B9/065

    摘要： In a conventional wafer chamfering process, the chamfered shape (cross-sectional shape) of the wafer circumference is uniform. However, in the chamfering step in wafer manufacture, the uniform chamfered shape varies with respective circumferential positions. Therefore, a wafer chamfering method that takes into account deformation in the chamfering step in the wafer manufacture is to be provided. The wafer chamfering method is for chamfering a wafer by bringing a grooveless grindstone into contact with the edge (circumferential end) of a wafer. By this wafer chamfering method, a movement trajectory formed by moving the wafer and the grindstone in a relative manner in the Z-axis and Y-axis directions and forming the same cross-sectional shape on the entire wafer circumference is set as a reference. So as to perform a processing operation in which the relative positions of the wafer and the grindstone are changed from positions on the reference trajectory at least in one of the Z-axis and Y-axis directions depending on wafer rotation angle positions, different cross-sectional shapes are formed depending on the wafer rotation angle positions with the use of a piezoelectric actuator.

    摘要翻译： 在传统的晶圆倒角工艺中，晶片圆周的倒角形状（横截面形状）是均匀的。 然而，在晶片制造中的倒角步骤中，均匀的倒角形状随着各个周向位置而变化。 因此，提供考虑到晶片制造中的倒角步骤中的变形的晶片倒角方法。 晶片倒角方法是通过使无槽磨石与晶片的边缘（圆周端）接触来倒角晶片。 通过该晶片倒角方法，设定通过使晶片和砂轮以相对于Z轴方向和Y轴方向移动而形成的移动轨迹，并且在整个晶片圆周上形成相同的横截面形状作为基准。 为了进行根据晶片旋转角位置至少在Z轴和Y轴方向之一上从基准轨迹上的位置改变晶片和磨石的相对位置的处理操作， 使用压电致动器，根据晶片旋转角度位置形成截面形状。

    Method of truing chamfering grindstone and chamfering device
    5.
    发明申请
    Method of truing chamfering grindstone and chamfering device 失效
    倒角磨石和倒角装置的修整方法

    公开(公告)号：US20050112999A1

    公开(公告)日：2005-05-26

    申请号：US10989513

    申请日：2004-11-17

    申请人： Ichiro Katayama ,  Youichi Nakamura

    发明人： Ichiro Katayama ,  Youichi Nakamura

    IPC分类号： B24B9/00 ,  B24B9/06 ,  B24B53/053 ,  B24B53/06 ,  B24B49/00

    CPC分类号： B24B53/06 ,  B24B9/065

    摘要： A truing method for a chamfering grindstone for performing chamfering work on a peripheral edge of a plate-shaped object, comprising the steps of: performing chamfering work on a truing grindstone with a master grindstone having a desired groove shape and forming a peripheral edge shape of the truing grindstone into a desired chamfered shape; and transferring the groove shape of the master grindstone onto the chamfering grindstone by performing grooving work on the chamfering grindstone with the chamfered truing grindstone to form the groove in the desired shape on the chamfering grindstone.

    摘要翻译： 一种用于在板状物体的周缘上进行倒角加工的倒角磨石的修整方法，包括以下步骤：对具有期望槽形状的主砂轮进行修整砂轮的倒角加工，并形成周向边缘形状 修整磨石成为所需的倒角形状; 并通过对倒角磨石对倒角磨石进行切槽加工，将主磨石的槽形转移到倒角磨石上，以在倒角磨石上形成所需形状的槽。

    Automatic drill bit re-pointing apparatus and method
    6.
    发明授权
    Automatic drill bit re-pointing apparatus and method 失效
    自动钻头重新定位装置和方法

    公开(公告)号：US06331133B1

    公开(公告)日：2001-12-18

    申请号：US09166767

    申请日：1998-10-05

    申请人： Ichiro Katayama ,  Yoshinobu Watanabe ,  Yuichi Nakajima ,  Yoshiharu Shinbo

    发明人： Ichiro Katayama ,  Yoshinobu Watanabe ,  Yuichi Nakajima ,  Yoshiharu Shinbo

    IPC分类号： B24B4900

    CPC分类号： B24B47/22 ,  B24B3/26

    摘要： A method and apparatus for automatically re-pointing twist drill bits includes a drill support mechanism including means for rotatably and axially translatably holding the shank of a drill bit, and a fluted portion receiver for supporting the fluted front cutting portion of the drill bit. The apparatus also includes an optical sensor unit which views the tip and blade part of the drill bit with the drill support mechanism in an off-line position, i.e., rotated away from a grinding wheel station. Responsive to error correction servo command signals received from a comparison of the actual orientation of drill bit cutting lips with a desired pre-determined template position, rotary and linear actuators in the drill support mechanism rotate the drill bit to the proper angular orientation, and advance the bit axially to a pre-determined protrusion length. Also, command signals to the fluted portion receiver elevate the drill bit point to a pre-determined elevation, whereupon a linear actuator cylinder linked via a pivot pin to the drill support mechanism rotates the latter to thereby place the properly oriented drill bit in contact with grinding wheels of a sharpening unit. After each of the grinding wheels has sequentially contacted the cutting edges and point of the drill bit and resurfaces the contacted areas to a desired sharpness, the linear actuator cylinder is used to rotate the drill support mechanism to the off-line position, whereupon a shank retainer is pivoted vertically away from the drill bit shank, allowing the re-conditioned bit to be removed and replaced with another bit to be re-pointed.

    摘要翻译： 用于自动重新指向麻花钻头的方法和装置包括钻头支撑机构，其包括用于可旋转和轴向平移地保持钻头柄的装置，以及用于支撑钻头的凹槽前切割部分的凹槽部分接收器。 该设备还包括光学传感器单元，其将钻头的尖端和刀片部分与钻头支撑机构相接触，即脱离砂轮台。 响应于从钻头切削唇的实际取向与期望的预定模板位置的比较接收到的误差校正伺服命令信号，钻头支撑机构中的旋转和线性致动器将钻头旋转到适当的角度定向，并且前进 轴位置到预定的突出长度。 此外，到槽纹部分接收器的命令信号将钻头点升高到预定的高度，于是通过枢轴销与钻头支撑机构相连的线性致动器圆筒将其旋转，从而使适当定向的钻头与 研磨单元的砂轮。 在每个砂轮顺序地接触钻头的切割边缘和点并将接触的区域重新显现为期望的清晰度之后，线性致动器圆柱体用于将钻头支撑机构旋转到离线位置，于是柄 保持架垂直远离钻头柄枢转，允许重新调节的钻头被移除并被另一个位重新定位。

    Sintered diamond drill bits and method of making
    8.
    发明授权
    Sintered diamond drill bits and method of making 失效
    烧结金刚石钻头及其制作方法

    公开(公告)号：US6029544A

    公开(公告)日：2000-02-29

    申请号：US753919

    申请日：1996-12-03

    申请人： Ichiro Katayama

    发明人： Ichiro Katayama

    IPC分类号： B23B27/14 ,  B23B51/00 ,  B23B51/02 ,  B23B51/10 ,  B23P15/28 ,  E21B10/44 ,  E21B10/56 ,  E21B10/567 ,  E21B10/58 ,  B23B27/20

    CPC分类号： E21B10/5676 ,  B23B27/146 ,  B23B51/009 ,  B23B51/02 ,  B23B51/108 ,  B23P15/28 ,  E21B10/44 ,  E21B10/58 ,  B23B2226/125 ,  B23B2226/315 ,  B23B2240/08 ,  B23B2251/50 ,  Y10S76/12 ,  Y10T407/26 ,  Y10T408/81 ,  Y10T408/9097

    摘要： A drill bit for cutting hard and abrasive materials has cutting lips formed from sintered polycrystalline diamond (PCD) or polycrystalline cubic boron nitride (PCBN) contained in one or more inserts installed in a drill bit blank. The inserts are made by forming depressions in the upper surface of a matrix slab of tungsten carbide, filling the depressions with fine mesh grains of diamonds or cubic born nitride, subjecting the slab to heat and pressure sufficient to fuse the grains to one another and to the surrounding matrix walls, and then cutting the matrix slab to remove individual inserts containing an elongated vein having an exposed PCD or PCBN surface supported by at least one and preferably two or more side walls of tungsten carbide. A rectangular slot having side walls parallel to one another and equidistant from the diameter of a cylindrical drill bit blank is cut into one transverse end wall of the blank, and one or more inserts placed in the slot. The tungsten carbide walls of the inserts are then brazed to the adjacent side walls of the slot. The bit is then ground to a desired configuration, in which PCD or PCBN material forms at least part of at least one cutting lip of the finished drill bit. Preferably, flutes are formed in drill bit blank as part of the grinding operation.

    摘要翻译： 用于切割硬质和磨蚀性材料的钻头具有由安装在钻头坯料中的一个或多个插入件中所包含的烧结多晶金刚石（PCD）或多晶立方氮化硼（PCBN）形成的切割唇。 刀片通过在碳化钨的矩阵板的上表面中形成凹陷来形成凹陷，用金刚石或立方出生的氮化物的细网格填充凹陷，对板进行加热和压力以使晶粒彼此熔合，并且 周围的基质壁，然后切割基质板以除去包含具有由碳化钨的至少一个且优选两个或更多个侧壁支撑的暴露的PCD或PCBN表面的细长静脉的各个插入物。 具有彼此平行并与圆柱形钻头坯料的直径相等的侧壁的矩形槽被切割成坯件的一个横向端壁，以及一个或多个插入件放置在槽中。 然后将插入件的碳化钨壁钎焊到槽的相邻侧壁。 然后将钻头研磨成所需的构造，其中PCD或PCBN材料形成成品钻头的至少一个切削刃的至少一部分。 优选地，在钻头坯料中形成凹槽作为研磨操作的一部分。

    Slicing method by a slicing machine
    9.
    发明授权
    Slicing method by a slicing machine 失效
    切片机的切片方法

    公开(公告)号：US5074276A

    公开(公告)日：1991-12-24

    申请号：US577128

    申请日：1990-09-04

    申请人： Ichiro Katayama

    发明人： Ichiro Katayama

    IPC分类号： B23D59/00 ,  B24B1/00 ,  B24B7/16 ,  B24B7/22 ,  B24B27/06 ,  B24B49/02 ,  B28D1/00 ,  B28D5/00 ,  B28D5/02

    CPC分类号： B24B49/02 ,  B23D59/001 ,  B24B1/00 ,  B24B27/0616 ,  B24B7/16 ,  B24B7/228 ,  B28D1/003 ,  B28D5/028

    摘要： A slicing method by use of a slicing machine in which, after a cylindrical material is moved by a predetermined amount of indexing, the cylindrical material is moved to a rotating blade in the slicing direction of the blade and is sliced into a wafer having a predetermined thickness, and at the same time the end face of the cylindrical material is ground. In the slicing method according to the invention, the grinding position and the amount of indexing of the cylindrical material can be corrected in accordance with the actually measured data of the thicknesses of the wafer after slicing, the data of axial displacements of the blade detected during slicing, and the actually measured data of the shapes of the end face of the cylindrical material after slicing of the wafer. Thus, the grinding position can be calculated accurately, the loss of the cylindrical material can be minimized, and the slicing can be carried out with an accurate amount of indexing, so that the wafer can be manufactured with high accuracy.

    Optical measuring apparatus which employs two synchronously rotating means to measure object
    10.
    发明授权
    Optical measuring apparatus which employs two synchronously rotating means to measure object 失效
    光学测量装置采用两个同步旋转装置来测量物体

    公开(公告)号：US4837432A

    公开(公告)日：1989-06-06

    申请号：US236448

    申请日：1988-08-25

    申请人： Ichiro Katayama

    发明人： Ichiro Katayama

    IPC分类号： G01B11/00 ,  G01B11/02

    CPC分类号： G01B11/02 ,  G01B11/00

    摘要： There is disclosed an optical measuring apparatus including a light scanning section for converting a light beam from a first light source to a parallel scanning light beam, a focussing section including a first focussing lens for focussing the parallel scanning light beam, an electric signal generating section for converting a focussed light to an electric signal, a measuring reference signal generating section and an electric signal processing section.The light scanning light section comprises a first mirror and a second mirror, each of which is rotated synchronously. The measuring reference comprises a transparent scale which is rotated in synchronism with the first and second mirrors, a light source, a second focussing lens and a second photoelectric conversion element. The electric signal processing section processes the electric signal from the electric signal generating section based on the measuring reference signal.