An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one conical projection in predetermined dimension and location. Rather than being permanently cojoined, the contact surfaces are attachable and detachable when desired. The individual conical projections are comprised of an ablative material, and at least some of the conical projections include a surface which is substantially comprised of material in a thickness capable of making ohmic contact, either by wiping with an intermeshing like structure or by contacting a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed by laser. The conical projections are optionally formed on the head of a contact pin.