发明授权
- 专利标题： Method of inspecting electric characteristics of wafers and apparatus therefor
- 专利标题（中）： 检查晶圆及其装置的电特性的方法
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申请号： US420525申请日： 1989-10-12
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公开(公告)号： US5124931A公开(公告)日： 1992-06-23
- 发明人: Masaaki Iwamatsu , Ryuichi Takebuchi , Yoshihito Marumo , Wataru Karasawa
- 申请人： Masaaki Iwamatsu , Ryuichi Takebuchi , Yoshihito Marumo , Wataru Karasawa
- 申请人地址： JPX Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX63-260244 19881014; JPX63-291718 19881118; JPX64-882 19890106
- 主分类号： G01R31/28
- IPC分类号： G01R31/28
摘要：
In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.
公开/授权文献
- US1625176A Compensating and drainage joint for pavements 公开/授权日：1927-04-19
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