公开(公告)号：US5124931A

公开(公告)日：1992-06-23

申请号：US420525

申请日：1989-10-12

申请人： Masaaki Iwamatsu ,  Ryuichi Takebuchi ,  Yoshihito Marumo ,  Wataru Karasawa

发明人： Masaaki Iwamatsu ,  Ryuichi Takebuchi ,  Yoshihito Marumo ,  Wataru Karasawa

IPC分类号： G01R31/28

CPC分类号： G01R31/2831

摘要： In a method of inspecting the electric characteristics of wafers, detecting for second and subsequent alignment operations of probe cards is automatically executed. In an apparatus for inspecting the electric characteristics of wafer, different types of wafers can be continuously inspected using the same probe card on the basis of prestored alignment data of each type of wafers.

摘要翻译： 在检查晶片的电特性的方法中，自动执行探针卡的第二次和随后的对准操作的检测。 在用于检查晶片的电特性的装置中，可以基于每种类型的晶片的预先存储的对准数据，使用相同的探针卡来连续检查不同类型的晶片。

公开(公告)号：US4966520A

公开(公告)日：1990-10-30

申请号：US430589

申请日：1989-11-01

申请人： Keiichi Yokota ,  Ryuichi Takebuchi

发明人： Keiichi Yokota ,  Ryuichi Takebuchi

IPC分类号： G01R31/316

CPC分类号： G01R31/316

摘要： A method of positioning a wafer when plural chips arranged on the semiconductor wafer are to be measured by a probe apparatus. The direction in which probes of the probe apparatus are set is measured via a dummy wafer and stored as data. The positioning of the wafer can be achieved by the operation of a table on which the wafer is mounted. When the wafer is to be positioned, the chips-lined direction on the wafer is rotated to align with the moving coordinates of the table and then with the probes-set direction. A probing direction in which wafers are successively moved and a reference position on the wafer are determined, and this reference position is aligned with the position of the probes. Measurement is carried out relative to every position of the chips calculated from the reference position, while moving the table along the probing direction.

摘要翻译： 通过探针装置测量配置在半导体晶片上的多个芯片时的晶片定位方法。 通过虚拟晶片测量探针装置的探针的设置方向，并作为数据存储。 晶片的定位可以通过其上安装有晶片的工作台的操作来实现。 当晶片定位时，晶片上的芯片排列的方向被旋转以与工作台的移动坐标，然后与探针设定方向对齐。 确定晶片连续移动并在晶片上的参考位置的探测方向，并且该参考位置与探针的位置对准。 沿着探测方向移动台，相对于从基准位置计算的芯片的每个位置进行测量。

公开(公告)号：US5321352A

公开(公告)日：1994-06-14

申请号：US922791

申请日：1992-07-31

申请人： Ryuichi Takebuchi

发明人： Ryuichi Takebuchi

IPC分类号： G01R1/073 ,  G01R31/28 ,  G01R1/067

CPC分类号： G01R1/07314 ,  G01R31/2887

摘要： A probe apparatus for measuring electrical characteristics of chips arranged on a wafer comprises a probe card having probe needles and a rotary chuck for supporting the wafer. The chuck is supported on an XY stage. A stationary alignment bridge is provided with a stationary camera and a capacitance sensor. The stage is provided with a movable camera. A transparent plate on which a target is formed is attached to the chuck. The target and its peripheral portion are formed of transparent thin films. The target is used for positioning and focusing of the cameras. The thin films are used for height detection by use of the capacitance sensor.

摘要翻译： 用于测量布置在晶片上的芯片的电特性的探针装置包括具有探针的探针卡和用于支撑晶片的旋转卡盘。 卡盘支撑在XY平台上。 固定对准桥设置有固定照相机和电容传感器。 舞台设置有可移动摄像头。 将形成有靶的透明板安装在卡盘上。 靶及其周边部分由透明薄膜形成。 该目标用于相机的定位和对焦。 薄膜用于通过使用电容传感器的高度检测。