发明授权
- 专利标题： Epoxy resin compositions and semiconductor devices encapsulated therewith
- 专利标题（中）： 环氧树脂组合物和封装的半导体器件
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申请号： US713841申请日： 1991-06-12
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公开(公告)号： US5162400A公开(公告)日： 1992-11-10
- 发明人: Toshio Shiobara , Takashi Tsuchiya , Kazutoshi Tomiyoshi , Takayuki Aoki
- 申请人： Toshio Shiobara , Takashi Tsuchiya , Kazutoshi Tomiyoshi , Takayuki Aoki
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX2-160489 19900618
- 主分类号： C08G59/62
- IPC分类号： C08G59/62 ; C08G8/00 ; C08G8/08 ; C08G59/00 ; C08G59/20 ; C08G59/24 ; C08G59/32 ; C08L63/00 ; H01B3/40 ; H01L23/29 ; H01L23/31
摘要：
An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.
公开/授权文献
- USD289417S Desk-top electronic calculator 公开/授权日：1987-04-21
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