At least a part of a protective layer (1, 4a, 4b, 5a, 5b, 6a, 6b,6c, 7, 8a, 8b) provided on the outer surface of a capacitance generating portion (2) of a film capacitor is constructed from a substantially non-oriented polyphenylenesulfide film (10). Since the non-oriented polyphenylenesulfide film (10) substantially does not accompany thermal shrinkage when it is heat stuck or soldered, and it absorbs the deformation due to the thermal shrinkage of other layers of the protective layer, the sticking stability and dimensional stability in the protective layer can be ensured. As a result, the thermal resistance of the protective layer and the thermal resistance of the capacitor can be improved as well as the simplification of sticking process or omission of an adhesive becomes possible. Moreover, this can serve to further miniaturization of capacitors.