摘要:
At least a part of a protective layer (1, 4a, 4b, 5a, 5b, 6a, 6b,6c, 7, 8a, 8b) provided on the outer surface of a capacitance generating portion (2) of a film capacitor is constructed from a substantially non-oriented polyphenylenesulfide film (10). Since the non-oriented polyphenylenesulfide film (10) substantially does not accompany thermal shrinkage when it is heat stuck or soldered, and it absorbs the deformation due to the thermal shrinkage of other layers of the protective layer, the sticking stability and dimensional stability in the protective layer can be ensured. As a result, the thermal resistance of the protective layer and the thermal resistance of the capacitor can be improved as well as the simplification of sticking process or omission of an adhesive becomes possible. Moreover, this can serve to further miniaturization of capacitors.
摘要:
A laminate comprising a non-oriented polyphenylenesulfide film and a biaxially oriented polyphenylenesulfide film bonded on at least one surface of the non-oriented polyphenylenesulfide film without using an adhesive, and process for producing it. The delamination of the laminate can be prevented and the tear strength can be increased by suppressing the crystallization of the non-oriented polyphenylenesulfide film. Since an adhesive is not interposed and the main component of the layers of the laminate is polyphenylenesulfide, the laminate can have excellent heat resistance, chemical resistance, electrical insulating property, wet heat resistance and processability with a good balance.
摘要:
An aluminum-metallized polyphenylenesulfide film capacitor. The polyphenylenesulfide film serves as at least a portion of dielectric material. The ratio of S/Al at the surface of the aluminum electrode which is determined by X-ray photoelectron spectroscopy method is not more than 0.14, or the ratio of Cl/Al at the surface of the aluminum electrode is not more than 0.013.
摘要:
Disclosed is a biaxially oriented poly-p-phenylene sulfide film prepared from a resin composition comprising poly-p-phenylene sulfide as its principal component, 20-1000 ppm of at least one metal belonging to IA group or IIA group of the periodic table and 100-600 ppm of nitrogen, the poly-p-phenylene sulfide having an weight average molecular weight Mw of 30,000-90,000, and a ratio of weight average molecular weight to number average molecular weight Mw/Mn of 3-10. The film of the present invention has an excellent mechanical properties and dimensional stability, as well as excellent clearness.
摘要:
A poly-p-phenylene sulfide resin composition comprising poly-p-phenylene sulfide as a principal component and 0.05 to 40 wt % (based on the total weight of the composition) of at least one metal component selected from the group consisting of zinc, lead, magnesium, manganese, barium and tin. The plastic materials prepared from the composition of this invention are greatly improved in resistance to copper contact and thermal resistance in closed air environment, and therefore are very useful for electrical insulation.
摘要:
The plasma display of the present invention is a plasma display in which a dielectric layer and stripe-shaped barrier ribs are formed on a substrate, and it is characterized in that there are inclined regions at the lengthwise direction ends of said barrier ribs and, furthermore, the height (Y) of the inclined regions and the length (X) of the base of the inclined regions are within the range 0.5≦X/Y≦100. Moreover, the method of the present invention for manufacturing a plasma display is characterized in that the aforesaid stripe-shaped barrier ribs are formed via a process in which a pattern of stripe-shaped barrier ribs having inclined regions at the ends is formed on a substrate using a barrier rib paste comprising inorganic material and organic component, and a process in which said barrier rib pattern is fired.
摘要翻译:本发明的等离子体显示器是在基板上形成电介质层和条状隔壁的等离子体显示器,其特征在于,在所述隔壁的纵向端部存在倾斜区域,此外 ,倾斜区域的高度(Y)和倾斜区域的基底的长度(X)在0.5 <= X / Y <100的范围内。 此外,用于制造等离子体显示器的本发明的方法的特征在于,上述条形阻挡肋是通过在基板上形成有在端部具有倾斜区域的条状隔壁的图案的方法形成的 使用包含无机材料和有机组分的隔壁糊料以及其中所述隔壁图案被烧制的工艺。
摘要:
A laminated polyphenylene sulfide film having excellent adhesiveness, especially heatsealability, and good mechanical properties and heat resistance, as well as a process for producing the same are disclosed. A central layer is constituted by a biaxially oriented polyphenylene sulfide film and a surface layer is constituted by phenylene sulfide copolymer containing a copolymerization unit other than p-phenylene sulfide unit in an amount of not less than 3 mol % and less than 50 mol %, so that the film has an improved adhesiveness and heatsealability while retaining the heat resistance and mechanical properties of biaxially oriented polyphenylene sulfide films.
摘要:
A laminate comprising a non-oriented polyphenylenesulfide film and a biaxially oriented polyphenylenesulfide film bonded on at least one surface of the non-oriented polyphenylenesulfide film without using an adhesive, and process for producing it. The delamination of the laminate can be prevented and the tear strength can be increased by suppressing the crystallization of the non-oriented polyphenylenesulfide film. Since an adhesive is not interposed and the main component of the layers of the laminate is polyphenylenesulfide, the laminate can have excellent heat resistance, chemical resistance, electrical insulating property, wet heat resistance and processability with a good balance.
摘要:
A polyphenylene sulfide (PPS) molded board reinforced with 15-85 wt. % of glass fibers (GF) having a length of at least 5 mm is provided. The molded board is useful as an insulating substrate of a printed circuit board. The printed circuit board is prepared by compressing under heating a mixture or laminate of PPS and GF to form a composite molded board and, at or after the compression step, bonding a metallic foil to a surface the composite molded board. The printed circuit board is excellent in mechanical properties such as impact resistance, thermal properties such as heat distortion temperature and solder resistance, and adhesion between the insulating substrate and the metallic foil.
摘要:
A sheet-like material and a printed circuit board comprised of the sheet-like material with a metallic film laminated thereon are provided wherein the sheet-like material is comprised of a composition mainly consisting of high molecular weight poly p-phenylenesulfide, characterized in that:a. the amount of related materials extracted through chloroform extraction of the poly p-phenylenesulfide containing related materials is less than 1.5 wt % of the entire weight of said poly p-phenylenesulfide prior to said extraction, andb. as measured by wide angle X-ray diffraction,(i) the index of crystallinity of said poly p-phenylenesulfide is in the range of above 2.5 and below 8.0,(ii) the crystallite size of said poly p-phenylenesulfide is in the range of above 50 A and below 100 A, and(iii) the orientation factors of said poly p-phenylenesulfide, measured in three directions comprising through the sample, edgewise and endwise, are above 0.70, as measured by wide angle x-ray diffraction.