发明授权
US5182495A Plasma processing method and apparatus using electron cyclotron resonance
失效
使用电子回旋共振的等离子体处理方法和装置
- 专利标题: Plasma processing method and apparatus using electron cyclotron resonance
- 专利标题(中): 使用电子回旋共振的等离子体处理方法和装置
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申请号: US619338申请日: 1990-11-29
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公开(公告)号: US5182495A公开(公告)日: 1993-01-26
- 发明人: Takuya Fukuda , Michio Ohue , Tadasi Sonobe
- 申请人: Takuya Fukuda , Michio Ohue , Tadasi Sonobe
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX1-307718 19891129
- 主分类号: C23C14/40
- IPC分类号: C23C14/40 ; C23C14/34 ; C23C14/35 ; C23C16/50 ; C23C16/511 ; C23F4/00 ; H01J37/32 ; H01L21/203 ; H01L21/205 ; H01L21/302 ; H01L21/3065 ; H01L21/31
摘要:
In a plasma processing apparatus using ECR, faces in contact with plasma excepting a substance to be processed are covered by an insulating material. By such configuration, discharge caused between the plasma and the substance to be processed in plasma processing is prevented beforehand.
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