发明授权
US5221426A Laser etch-back process for forming a metal feature on a non-metal
substrate
失效
用于在非金属衬底上形成金属特征的激光蚀刻工艺
- 专利标题: Laser etch-back process for forming a metal feature on a non-metal substrate
- 专利标题(中): 用于在非金属衬底上形成金属特征的激光蚀刻工艺
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申请号: US799804申请日: 1991-11-29
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公开(公告)号: US5221426A公开(公告)日: 1993-06-22
- 发明人: Theodore G. Tessier , John W. Stafford , William F. Hoffman
- 申请人: Theodore G. Tessier , John W. Stafford , William F. Hoffman
- 申请人地址: IL Schaumburg
- 专利权人: Motorola Inc.
- 当前专利权人: Motorola Inc.
- 当前专利权人地址: IL Schaumburg
- 主分类号: H01L21/3213
- IPC分类号: H01L21/3213 ; H05K3/02 ; H05K3/06 ; H05K3/10 ; H05K3/38 ; H05K3/46
摘要:
An improved laser etch-back process forms a metal feature on an area of a polymeric or other non-metallic substrate. The process comprises forming a metal layer on the area that includes a first, relatively thick section, and a second, relatively thin section. Thereafter, the metal layer is uniformly irradiated with a laser pulse, but not to vaporize metal from the thick section. Thus, the laser pulse selectively etches the thin section to remove the metal and expose the substrate, without disturbing the thick section, which forms the desired metal feature.
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