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公开(公告)号：US5818404A
公开(公告)日：1998-10-06
申请号：US610532
申请日：1996-03-04
CPC分类号： H04M1/0202 , H01L25/167 , H01L2224/48227 , H01L2924/12044 , H04M1/0272
摘要： An integrated electro-optical package (50) including an optically transparent substrate (10) with an array (15) of light emitting devices (LEDs) (12) thereon, cooperating to generate a complete image, thereby forming a LED display chip (14). The LEDs (12) are positioned in rows and columns and having electrical connections adjacent outer edges of the substrate (10). A molded base (30), having embedded electrical conductors (31) for cooperating with the LEDs (12) of the LED display chip (14) and further having a refractive or diffractive lens (60) formed within a central opening (35), in alignment with the array (15) of LEDs (12) of the LED display chip (14) and on a side opposite the mounting of the LED display chip (14), thereby capable of magnifying the image and producing an easily viewable virtual image. A driver substrate (55) having electrical connections for interfacing with the molded base (30). A plurality of driver circuits (57) connected to the molded base (30) and LEDs (12) through electrodes on the driver substrate (55).
摘要翻译： 包括其上具有发光器件（LED）（12）的阵列（15）的光学透明衬底（10）的集成电光学封装（50），其协作以产生完整的图像，由此形成LED显示芯片（14） ）。 LED（12）定位成行和列，并且具有与衬底（10）的外边缘相邻的电连接。 一种模制基座（30），其具有用于与LED显示芯片（14）的LED（12）配合并且还具有形成在中心开口（35）内的折射或衍射透镜（60）的嵌入式电导体（31） 与LED显示芯片（14）的LED（12）的阵列（15）对准，并且在与LED显示芯片（14）的安装相反的一侧，从而能够放大图像并产生容易观看的虚像 。 具有用于与模制基座（30）对接的电连接的驱动器基板（55）。 通过驱动器基板（55）上的电极连接到模制基座（30）和LED（12）的多个驱动电路（57）。
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公开(公告)号：US5789815A
公开(公告)日：1998-08-04
申请号：US636483
申请日：1996-04-23
IPC分类号： H01L23/31 , H01L25/065 , H01L23/495 , H01L23/02 , H01L23/34
CPC分类号： H01L23/3121 , H01L25/0652 , H01L2224/16225 , H01L2924/09701 , H01L2924/1433 , H01L2924/3025
摘要： A three dimensional packaging approach reduces the overall footprint for interconnecting multiple semiconductor die. An three-dimensional folded module (10) produces a final package having a footprint size reduced by an approximate factor of four when compared to conventional electronic packaging. The module has a protective covering such as a cap (62) or a sealant (64) as a moisture barrier. Thus, high integration using flexible appendages (15, 25, 35, and 45) attached to a rigid substrate (12) and singularly folded above the substrate (12) results in both a small footprint package and also a light package. A reel-to-reel flex tape (56) assembly provides pre-tested flex boards (16, 26, 36, and 46) resulting in a cost-effective manufacturable package for semiconductor components.
摘要翻译： 三维封装方法减少了用于互连多个半导体管芯的整体占用空间。 与常规电子封装相比，三维折叠模块（10）产生具有减小约四倍的占地面积尺寸的最终包装。 模块具有作为防潮层的保护盖，例如盖（62）或密封剂（64）。 因此，使用附接到刚性基板（12）并且单独地折叠在基板（12）上方的柔性附件（15,25,35和45）的高集成度导致小尺寸封装以及光封装。 卷对卷柔性带（56）组件提供预测试的柔性板（16,26,36和46），从而产生用于半导体部件的成本有效的可制造的封装。
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3.发明授权Integrated electro-optical package with LED display chip and substrate with drivers and central opening 失效集成电光封装，带LED显示芯片和基板，带驱动器和中心开口
公开(公告)号：US5739800A
公开(公告)日：1998-04-14
申请号：US610506
申请日：1996-03-04
CPC分类号： H01L25/167 , H04N5/2254 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H01L2924/18301
摘要： An integrated electro-optical package (50) including a light emitting device (LED) display chip (14), with an array (15) of light emitting devices (LEDs) (12) formed thereon and cooperating to generate a complete image. The LEDs (12) are positioned in rows and columns and connected to connection/mounting pads (22) adjacent outer edges of the chip (14). An opaque mounting substrate (30) having a central opening (35). A driver substrate (55) having mounting pads (34), bump bonded to a plurality of pads (33) and (34) on the mounting substrate (30). A plurality of driver circuits (57) connected to the LEDs (12) through terminals on the driver substrate (55). A lens (60) mounted to the mounting substrate (30) over the array (15) of LEDs (12) and on a side opposite the LED display chip (14) to magnify, or serve as one element of an optical magnifier system, the complete image and produce an easily viewable virtual image.
摘要翻译： 一种包括发光器件（LED）显示芯片（14）的集成电光学封装（50），其上形成有发光器件（LED）（12）的阵列（15），并配合以产生完整的图像。 LED（12）以行和列定位并且连接到与芯片（14）的外边缘相邻的连接/安装焊盘（22）。 具有中心开口（35）的不透明安装基板（30）。 具有安装焊盘（34）的驱动器基板（55），凸块接合到安装基板（30）上的多个焊盘（33）和（34）。 通过驱动器基板（55）上的端子与LED（12）连接的多个驱动电路（57）。 在LED（12）的阵列（15）上并且在与LED显示芯片（14）相对的一侧上安装到安装基板（30）上的放大或用作光放大器系统的一个元件的透镜（60） 完整的图像并产生一个容易观看的虚拟图像。
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4.发明授权
公开(公告)号：US5699073A
公开(公告)日：1997-12-16
申请号：US610501
申请日：1996-03-04
CPC分类号： H04N5/2253 , H01L25/167 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044
摘要： An integrated electro-optical package (40) including an optically transparent substrate (10) with an array (15) of light emitting devices (LEDs) (12) formed thereon, cooperating to generate a complete image, thereby forming a LED display chip (14). The LEDs (12) are positioned in rows and columns and having electrical connections adjacent outer edges of the substrate (10). A driver board (30), having embedded electrical conductors (34), plated through-hole vias (44) and/or embedded leadframes (45) for cooperating with the LEDs (12) of the LED display chip (14) and further having a plurality of driver and control circuits (42) connected to the driver board (30) and LEDs (12). A molded carrier ring (50), electrically interfaced with the driver board (30), the LED display chip (14) and the driver and control circuits (42). A molded refractive or diffractive lens (60) positioned in alignment with the array (15) of LEDs (12) of the LED display chip (14) and on a side opposite the mounting of the LED display chip (14), thereby capable of magnifying the image and producing an easily viewable virtual image.
摘要翻译： 包括形成在其上的发光器件（LED）（12）的阵列（15）的光学透明衬底（10）的集成电光学封装（40）配合以产生完整的图像，从而形成LED显示芯片（ 14）。 LED（12）定位成行和列，并且具有与衬底（10）的外边缘相邻的电连接。 具有嵌入式电导体（34）的驱动器板（30），用于与LED显示芯片（14）的LED（12）配合的电镀通孔（44）和/或嵌入式引线框架（45），并且还具有 连接到驱动器板（30）和LED（12）的多个驱动器和控制电路（42）。 与驱动器板（30）电连接的模制载体环（50），LED显示芯片（14）和驱动器和控制电路（42）。 与LED显示芯片（14）的LED（12）的阵列（15）对准并且与LED显示芯片（14）的安装相对的一侧定位成型的折射或衍射透镜（60），从而能够 放大图像并产生容易观看的虚拟图像。
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公开(公告)号：US5432358A
公开(公告)日：1995-07-11
申请号：US216995
申请日：1994-03-24
申请人： Ronald J. Nelson , John W. Stafford
发明人： Ronald J. Nelson , John W. Stafford
IPC分类号： G02B6/122 , G02B27/02 , G09F9/33 , H01L25/16 , H01L27/15 , H01L31/12 , H01L33/00 , H01L23/02
CPC分类号： G09F9/33 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/09701
摘要： An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.
摘要翻译： 一种集成的电光学封装，包括形成有大量发光器件阵列的半导体芯片，并配合以产生完整的真实图像。 发光器件被定位成行和列并且连接到与芯片的外边缘相邻的焊盘。 一种窗框基板，其具有与由芯片和安装焊盘产生的实像共同延伸的中心开口，凸块接合到芯片上的焊盘。 多个驱动电路通过窗框基板上的端子连接到发光器件。 透镜在开口上和与芯片相对的一侧安装到基板，以放大实际图像并产生容易观看的虚像。
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公开(公告)号：US5194137A
公开(公告)日：1993-03-16
申请号：US740272
申请日：1991-08-05
CPC分类号： B23K1/0016 , H05K3/3473 , H05K1/11 , H05K2203/042 , H05K2203/043
摘要： A method for forming a solder-bumped terminal on a planar dielectric substrate utilizes a terminal of a particular configuration and comprises depositing onto the terminal a thin plate of solder alloy and reflowing the solder alloy to form a bump. The terminal configuration includes an enlarged terminal pad connected to a relatively narrow linear runner section. Preferably, the runner section width is between about 50 and 150 microns, whereas the pad width is between about 1.2 and 2.0 times the runner section width. The terminal is initially fabricated to include a metal layer adjacent the substrate formed, for example, of copper and a thin, outer plate composed of the solder alloy. The solder plate is deposited in a uniform thickness to both the terminal pad and the adjacent runner section. The terminal is then heated to melt the solder plate, whereupon the molten solder is drawn from the runner onto the enlarged pad to form a bump. In a preferred embodiment, a solder plate between about 10 and 25 microns is electrodeposited onto the terminal and reflowed to form a bump having a height between 60 and 80 microns.
摘要翻译： 在平面电介质基板上形成焊料凸起端子的方法利用特定结构的端子，并且包括在端子上沉积焊料合金薄板并回流焊料合金以形成凸块。 端子配置包括连接到相对窄的线性流道部分的放大的端子焊盘。 优选地，流道截面宽度在约50至150微米之间，而垫宽度在流道截面宽度的约1.2和2.0倍之间。 端子最初被制造成包括邻近由例如铜形成的衬底的金属层和由焊料合金组成的薄的外部板。 焊接板以均匀的厚度沉积到端子焊盘和相邻的流道部分。 然后将端子加热以熔化焊料板，然后将熔融的焊料从流道拉出到扩大的焊盘上以形成凸块。 在优选实施例中，约10至25微米之间的焊料电极电沉积到端子上并回流以形成高度在60至80微米之间的凸起。
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7.发明授权
公开(公告)号：US4762386A
公开(公告)日：1988-08-09
申请号：US902374
申请日：1986-09-02
CPC分类号： G02B6/4204 , G02B6/4225 , G02B6/4248 , G02B6/4448 , G02B6/4207 , G02B6/4238 , H01S5/02248 , H01S5/02284 , H01S5/024
摘要： An optical fiber assembly 54 includes, an optical fiber 45, a tube 49 surrounding the fiber 45, a bushing 55 encircling the tube 49, a second tube 52 surrounding the fiber, and the fiber 45 is bent to a smoothly curved configuration within the confines of the tube 49 in relief of a column load applied on the fiber 45 by the tubes 49, 52.
摘要翻译： 光纤组件54包括光纤45，围绕光纤45的管49，围绕管49的衬套55，围绕光纤的第二管52，并且光纤45弯曲成在限定范围内的平滑弯曲形状 通过管49,52释放施加在纤维45上的柱载荷。
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公开(公告)号：US5905750A
公开(公告)日：1999-05-18
申请号：US731424
申请日：1996-10-15
申请人： Michael S. Lebby , Wenbin Jiang , John W. Stafford
发明人： Michael S. Lebby , Wenbin Jiang , John W. Stafford
CPC分类号： H01S5/02296 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L24/73 , H01L2924/181 , H01S5/02228 , H01S5/02244 , H01S5/02276 , H01S5/0683 , H01S5/183
摘要： A semiconductor laser package including a laser chip mounted to an uppermost surface of a leadframe, and a molded structure at least partially encapsulating the laser chip. The laser chip composed of a vertical cavity surface emitting laser and an optional photodetector. The vertical cavity surface emitting laser generating an emission along a path. The molded structure including an optical element positioned a specific distance from an emission aperture of the vertical cavity surface emitting laser. The laser chip and the optical element mounted in precise z-axis alignment from the emission aperture of the vertical cavity surface emitting laser utilizing the uppermost surface of the leadframe as a dimensional reference point.
摘要翻译： 一种半导体激光器封装，包括安装在引线框架的最上表面的激光芯片，以及至少部分地封装激光芯片的模制结构。 激光芯片由垂直腔表面发射激光器和可选的光电检测器组成。 垂直腔表面发射激光器沿着路径产生发射。 模制结构包括位于与垂直腔表面发射激光器的发射孔相距特定距离的光学元件。 激光芯片和光学元件以垂直腔表面发射激光器的发射孔径以准确的z轴对准安装，利用引线框架的最上表面作为尺寸参考点。
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公开(公告)号：US5689279A
公开(公告)日：1997-11-18
申请号：US415286
申请日：1995-04-03
申请人： Ronald J. Nelson , John W. Stafford
发明人： Ronald J. Nelson , John W. Stafford
CPC分类号： G09F9/33 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/09701
摘要： An integrated electro-optical package including a semiconductor chip with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the chip. A window frame substrate having a central opening therethrough coextensive with the real image generated by the chip and mounting pads, bump bonded to the pads on the chip. A plurality of driver circuits connected to the light emitting devices through terminals on the window frame substrate. A lens mounted to the substrate over the opening and on a side opposite the chip to magnify the real image and produce an easily viewable virtual image.
摘要翻译： 一种集成的电光学封装，包括形成有大量发光器件阵列的半导体芯片，并配合以产生完整的真实图像。 发光器件被定位成行和列并且连接到与芯片的外边缘相邻的焊盘。 一种窗框基板，其具有与由芯片和安装焊盘产生的实像共同延伸的中心开口，凸块接合到芯片上的焊盘。 多个驱动电路通过窗框基板上的端子连接到发光器件。 透镜在开口上和与芯片相对的一侧安装到基板，以放大实际图像并产生容易观看的虚像。
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公开(公告)号：US4762395A
公开(公告)日：1988-08-09
申请号：US150481
申请日：1988-01-29
IPC分类号： G02B7/02
CPC分类号： G02B7/026
摘要： A lens assembly 26 includes, a lens 27, an optical diaphragm 29 as a convex curved leaf spring, a pedestal 30 spacing the diaphragm 29 from the lens 27, and a holder for mounting the lens assembly 26 in desired position.
摘要翻译： 透镜组件26包括透镜27，作为凸弯曲板簧的光学膜29，将隔膜29与透镜27间隔开的基座30和用于将透镜组件26安装在期望位置的保持器。
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