发明授权
- 专利标题： Mechanical lift-off process of a metal layer on a polymer
- 专利标题（中）： 聚合物上金属层的机械剥离过程
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申请号： US944732申请日： 1992-09-14
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公开(公告)号： US5234539A公开(公告)日： 1993-08-10
- 发明人: Andre Schiltz , Jean Palleau , Joaquim Torres
- 申请人： Andre Schiltz , Jean Palleau , Joaquim Torres
- 申请人地址： FRX Paris
- 专利权人： France Telecom (C.N.E.T.)
- 当前专利权人： France Telecom (C.N.E.T.)
- 当前专利权人地址： FRX Paris
- 优先权： FRX9002690 19900223
- 主分类号： H01L21/027
- IPC分类号： H01L21/027 ; H01L21/768 ; H05K3/02 ; H05K3/04 ; H05K3/40
摘要：
A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its interface with the metal has a low adhesivity; applying to the structure a mechanical stress causing detachment of the metal at the interface; and chemically removing the intermediate layer.
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