公开(公告)号：US5300457A

公开(公告)日：1994-04-05

申请号：US830636

申请日：1992-02-04

申请人： Andre Schiltz ,  Louis Thevenot ,  Aime Vareille

发明人： Andre Schiltz ,  Louis Thevenot ,  Aime Vareille

IPC分类号： H01L21/52 ,  H01L21/58 ,  H01L21/68 ,  H01L21/60

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/743 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01013 ,  H01L2924/01052 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14

摘要： Method for the insertion of chips into housings let into a substrate especially of the hybrid type, consisting, before fixing the chips (1a) into the abovementioned housings (2a), in holding the chips (1a) respectively in the abovementioned housings (2a) by the agency of a film (6) which is bonded to one of the faces of the substrate (3) and to which are bonded the chips.

摘要翻译： 在将芯片（1a）分别固定在上述壳体（2a）中之前，将芯片（1a）分别保持在上述壳体（2a）中之前，将芯片插入到特别是混合型的基板的壳体中的方法， 通过粘合到基板（3）的一个表面并与芯片接合的薄膜（6）的机构。

公开(公告)号：US5234539A

公开(公告)日：1993-08-10

申请号：US944732

申请日：1992-09-14

申请人： Andre Schiltz ,  Jean Palleau ,  Joaquim Torres

发明人： Andre Schiltz ,  Jean Palleau ,  Joaquim Torres

IPC分类号： H01L21/027 ,  H01L21/768 ,  H05K3/02 ,  H05K3/04 ,  H05K3/40

CPC分类号： H01L21/7688 ,  H01L21/0272 ,  H05K3/02 ,  H05K3/048 ,  H05K3/4076

摘要： A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its interface with the metal has a low adhesivity; applying to the structure a mechanical stress causing detachment of the metal at the interface; and chemically removing the intermediate layer.

摘要翻译： 用于去除金属层（4）的一部分的剥离工艺。 金属层形成在具有中间层（2）的相应部分的介电聚合物基板上。 该方法包括选择中间层的材料以使其与金属的界面具有低粘合性的步骤; 向结构施加导致金属在界面处分离的机械应力; 并化学去除中间层。

公开(公告)号：US5343049A

公开(公告)日：1994-08-30

申请号：US023687

申请日：1993-02-26

申请人： Aime Vareille ,  Andre Schiltz ,  Jean C. Hauuy

发明人： Aime Vareille ,  Andre Schiltz ,  Jean C. Hauuy

IPC分类号： G01B11/14 ,  G01N21/86

CPC分类号： G01B11/14

摘要： Optical method for determining the lateral gap of two pieces (1, 2) having adjacent edges (3, 4) forming a slot (5) consisting in emitting a parallel light beam (8) through at least one zone of said slot, from one side of the latter; in detecting the beam (8a) passing through this zone of said slot, at the other side of the latter; and in comparing the light intensity of this beam transversing said zone with a predetermined value so as to obtain or to provide the gap between the edges of said pieces in said zone. This method may be applied to the positioning of a first piece, such as a chip, opposite or in an opening made in a second piece, such as a substrate, and may consist in moving said first piece in order to bring it above the opening of the second piece, in comparing, as the first piece moves, the light intensity passing through the slot separating said pieces and in stopping the movement of the first piece when the intensity of the light through-beam is equal to a predetermined value.

摘要翻译： 用于确定具有形成狭槽（5）的相邻边缘（3,4）的两个（1,2）的横向间隙的光学方法，所述狭缝（5）包括通过所述槽的至少一个区域从一个区域发射平行光束（8） 后者; 在检测通过所述槽的该区域的梁（8a）的另一侧; 并且将该横梁的光强度与所述区域进行比较以预定值进行比较，以便获得或提供所述区段中的所述碎片的边缘之间的间隙。 该方法可以应用于诸如芯片的第一部件的相对或在诸如基板的第二部件中形成的开口中的定位，并且可以包括移动所述第一部件以使其高于开口 在比较第一部分移动时，通过分隔所述片的狭缝的光强度和当光束的强度等于预定值时停止第一片的移动。

公开(公告)号：US5285252A

公开(公告)日：1994-02-08

申请号：US997608

申请日：1992-12-28

申请人： Aime Vareille ,  Andre Schiltz ,  Jean C. Hauuy

发明人： Aime Vareille ,  Andre Schiltz ,  Jean C. Hauuy

IPC分类号： G01B9/02 ,  G01B11/00 ,  G01C3/08

CPC分类号： G01B9/02007 ,  G01B9/02011 ,  G01B2290/45 ,  G01B2290/70

摘要： An optical method and optical device for distance measurement, comprising the steps of emitting an incident light beam (13) comprising at least two waves of differing wavelengths (.lambda.1 and .lambda.2); separating this beam into a reference beam (15) and a measurement beam (17) which are reflected on, respectively, a reference reflector (16) and a zone (18) of a part (19), of which it is desired to measure the position in the direction of the measurement beam and recombine into a resultant beam (20), in which said waves exhibit conditions of polarization, the components of which rotate when the optical path of the aforementioned measurement beam varies and which determine, in the direction of the measurement beam, adjacent ranges at the ends of each one of which the angular positions of two corresponding components of these conditions of polarization are identical; determining, in the resultant beam (20), the angular positions (.alpha.1 and .alpha.2) of two corresponding components of said conditions of polarization of said waves; and computing, as a function of said angular positions, the distance separating the aforementioned zone of said part from a reference position, preferably the image of the reference reflector.Their application to the positioning of parts, especially of a chip inserted in a substrate.

摘要翻译： 一种用于距离测量的光学方法和光学装置，包括以下步骤：发射包括不同波长（（λ）1和（λ）2）的至少两个波的入射光束（13）; 将该光束分成反射在参考反射器（16）和部分（19）的区域（18）上的参考光束（15）和测量光束（17），其中希望测量 在所述测量光束的方向上的位置并且复合到合成光束（20）中，其中所述波展现出偏振状态，当所述测量光束的光路变化时，其分量旋转，并且在所述方向 的测量光束，其中每个测量光束两端的相邻范围，这些极化条件的两个对应分量的角位置相同; 在合成光束（20）中确定所述波的所述极化条件的两个对应分量的角位置（（α）1和（α）2） 以及根据所述角度位置计算将所述部件的上述区域与参考位置分开的距离，优选地，参考反射器的图像。 它们适用于部件的定位，特别是插入基板的芯片。

公开(公告)号：US5392368A

公开(公告)日：1995-02-21

申请号：US989067

申请日：1992-12-11

申请人： Andre Schiltz

发明人： Andre Schiltz

IPC分类号： G02B6/00 ,  G02B6/26 ,  G02B6/30 ,  G02B6/42

CPC分类号： G02B6/30 ,  G02B6/4204

摘要： A process for mounting of an optical fiber (1) on a substrate (2) and for optical coupling between this fiber and an optical or optoelectronic element (17) or component such as a waveguide, a receiver or an emitter formed or carried on the front face (5) by the substrate, consisting in inserting the end of an optical fiber (1) into a through orifice (6) formed in the substrate (2) engaging it by the rear face of the substrate, in sealing the end of the optical fiber in said orifice, and in forming on the path of the optical wave a deflecting facet (18) such that the optical wave originating from the optical fiber is deflected by this facet towards said element or component (17), or vice versa.

摘要翻译： 一种用于将光纤（1）安装在基板（2）上并用于在该光纤与光学或光电子元件（17）或诸如波导，接收器或发射器之间的光耦合的光耦合的过程，所述光学或光电子元件 基板的前表面（5），其包括将光纤（1）的端部插入到形成在基板（2）中的通孔（6）中，所述通孔与基板的后表面接合， 所述孔中的光纤，并且在光波路径上形成偏转小面（18），使得源自光纤的光波被该小面朝向所述元件或部件（17）偏转，反之亦然 。

公开(公告)号：US5152868A

公开(公告)日：1992-10-06

申请号：US664342

申请日：1991-03-04

申请人： Andre Schiltz ,  Marie-Jeanne Bouzid

发明人： Andre Schiltz ,  Marie-Jeanne Bouzid

IPC分类号： H01L21/60 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/3213 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01R11/01 ,  H05K3/00 ,  H05K3/02 ,  H05K3/04 ,  H05K3/10 ,  H05K3/14 ,  H05K3/16 ,  H05K3/46

CPC分类号： H05K3/107 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/5387 ,  H05K3/048 ,  H01L2924/0002 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K3/0041 ,  H05K3/146 ,  H05K3/16 ,  H05K3/467 ,  Y10S428/901 ,  Y10T29/49204 ,  Y10T428/24917

摘要： An elastomer connector is disclosed for integrated circuits or similar, comprising an elastomer material support on one face of which is formed a dense network of electro-conducting lines. Using photo-etching techniques and metal deposition on a layer of strippable material, which techniques are used for manufacturing integrated circuits, the lines may be given a very small width and very high conductivity.

摘要翻译： 公开了用于集成电路或类似物的弹性体连接器，其包括弹性体材料支撑件，其一面上形成有致密网络的导电线。 使用光刻技术和金属沉积在可剥离材料层上，哪些技术用于制造集成电路，这些线可以被给予非常小的宽度和非常高的导电性。