发明授权
US5258325A Method for manufacturing a semiconductor device using a circuit transfer film 失效
使用电路转印膜制造半导体器件的方法

Method for manufacturing a semiconductor device using a circuit transfer
film
摘要:
The invention relates to device processing, packaging and interconnects that will yield integrated electronic circuitry of high density and complexity. Processes include the formation of complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. Circuit modules using integrated transfer/interconnect processes compatible with extremely high density and complexity provide large-area active-matrix displays with on-board drivers and logic in modules.
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