发明授权
US5261593A Direct application of unpackaged integrated circuit to flexible printed
circuit
失效
直接应用未封装的集成电路到柔性印刷电路
- 专利标题： Direct application of unpackaged integrated circuit to flexible printed circuit
- 专利标题（中）： 直接应用未封装的集成电路到柔性印刷电路
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申请号： US932064申请日： 1992-08-19
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公开(公告)号： US5261593A公开(公告)日： 1993-11-16
- 发明人: Keith L. Casson , Kelly D. Habeck , Eugene T. Selbitschka
- 申请人： Keith L. Casson , Kelly D. Habeck , Eugene T. Selbitschka
- 申请人地址： MN Northfield
- 专利权人： Sheldahl, Inc.
- 当前专利权人： Sheldahl, Inc.
- 当前专利权人地址： MN Northfield
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/498 ; H05K1/18 ; H05K3/34
摘要：
A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.
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