公开(公告)号：US5261593A

公开(公告)日：1993-11-16

申请号：US932064

申请日：1992-08-19

申请人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

发明人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/189 ,  H05K2201/10992 ,  H05K3/3484 ,  Y02P70/613

摘要： A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.

摘要翻译： 描述了将倒装芯片电连接到柔性印刷电路基板的方法。 该方法包括（1）将焊膏提供给位于柔性印刷电路基板上的多个有源接触焊盘，（2）将倒装芯片放置在基板上，使得位于倒装芯片上的焊料凸块与焊膏对准 在有源接触焊盘上，和（3）整体加热所得到的组件，使得每个有源接触焊盘上的焊膏回流以与其对应的焊料凸点形成电连接。

公开(公告)号：US5349500A

公开(公告)日：1994-09-20

申请号：US81544

申请日：1993-06-23

申请人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

发明人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC分类号： H01L24/81 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/189 ,  H05K2201/10992 ,  H05K3/3484 ,  Y02P70/613

摘要： An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad fellows to form an electrical connection with its corresponding solder bump.

摘要翻译： 描述了将倒装芯片电连接到柔性印刷电路基板的装置。 该装置包括（1）向位于柔性印刷电路基板上的多个有源接触垫提供焊膏，（2）将倒装芯片放置在基板上，使得位于倒装芯片上的焊料凸块与焊膏对准 在有源接触焊盘上，和（3）整体加热所得到的组件，使得每个有源接触焊盘上的焊膏与其相应的焊料凸块形成电连接。