公开(公告)号：US5840402A

公开(公告)日：1998-11-24

申请号：US265649

申请日：1994-06-24

申请人： Sidney J. Roberts ,  Eugene T. Selbitschka ,  Glenn W. Gengel ,  Brent N. Sweitzer

发明人： Sidney J. Roberts ,  Eugene T. Selbitschka ,  Glenn W. Gengel ,  Brent N. Sweitzer

IPC分类号： B32B15/08 ,  H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  B32B3/00

CPC分类号： H05K3/426 ,  H05K1/0287 ,  H05K1/0393 ,  H05K3/0017 ,  H05K3/022 ,  H05K3/064 ,  H05K3/388 ,  H05K3/4076 ,  Y10S428/901 ,  Y10T29/49167 ,  Y10T428/24273 ,  Y10T428/24347 ,  Y10T428/264 ,  Y10T428/31681 ,  Y10T428/31688

摘要： A metallized laminate material for the manufacture of high performance, high density printed wiring boards and the like includes an ordered distribution of via holes electrically interconnecting opposing conductive layers on a dielectric polymeric film substrate. Furthermore, opposing photoresist layers substantially cover the conductive layers and vias. The conductive material in the conductive layers and the vias is bonded adhesivelessly to the substrate to provide a high degree of delamination resistance. The production of metallized laminate material is preferably carried out in a roll-to-roll process suitable for high volume, low cost production. In use, an end user may manufacture customized printed wiring boards in small volume runs from the laminate material with a reduced amount of equipment, expertise and cost.

摘要翻译： 用于制造高性能，高密度印刷线路板等的金属化层压材料包括将电介质聚合物膜基底上相对的导电层电连接的通孔的有序分布。 此外，相对的光致抗蚀剂层基本上覆盖导电层和通孔。 导电层和通孔中的导电材料无粘合地粘合到基底上以提供高度的耐分层性。 金属化层压材料的生产优选以适于大批量，低成本生产的卷对卷方法进行。 在使用中，最终用户可以以较少量的设备，专业知识和成本从层压材料制造具有小体积运行的定制印刷线路板。

公开(公告)号：US5349500A

公开(公告)日：1994-09-20

申请号：US81544

申请日：1993-06-23

申请人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

发明人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34 ,  H05K1/00

CPC分类号： H01L24/81 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/189 ,  H05K2201/10992 ,  H05K3/3484 ,  Y02P70/613

摘要： An apparatus is described for electrically connecting flip chips to a flexible printed circuit substrate. The apparatus comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad fellows to form an electrical connection with its corresponding solder bump.

摘要翻译： 描述了将倒装芯片电连接到柔性印刷电路基板的装置。 该装置包括（1）向位于柔性印刷电路基板上的多个有源接触垫提供焊膏，（2）将倒装芯片放置在基板上，使得位于倒装芯片上的焊料凸块与焊膏对准 在有源接触焊盘上，和（3）整体加热所得到的组件，使得每个有源接触焊盘上的焊膏与其相应的焊料凸块形成电连接。

公开(公告)号：US5261593A

公开(公告)日：1993-11-16

申请号：US932064

申请日：1992-08-19

申请人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

发明人： Keith L. Casson ,  Kelly D. Habeck ,  Eugene T. Selbitschka

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13007 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/189 ,  H05K2201/10992 ,  H05K3/3484 ,  Y02P70/613

摘要： A method is described for electrically connecting flip chips to a flexible printed circuit substrate. The method comprises (1) providing solder paste to a plurality of active contact pads located on the flexible printed circuit substrate, (2) placing the flip chips on the substrate such that solder bumps located on the flip chips are in registration with the solder paste on the active contact pads, and (3) heating the resulting assembly as a whole so that the solder paste on each active contact pad reflows to form an electrical connection with its corresponding solder bump.

摘要翻译： 描述了将倒装芯片电连接到柔性印刷电路基板的方法。 该方法包括（1）将焊膏提供给位于柔性印刷电路基板上的多个有源接触焊盘，（2）将倒装芯片放置在基板上，使得位于倒装芯片上的焊料凸块与焊膏对准 在有源接触焊盘上，和（3）整体加热所得到的组件，使得每个有源接触焊盘上的焊膏回流以与其对应的焊料凸点形成电连接。