发明授权
- 专利标题： Thin film process monitoring techniques using acoustic waves
- 专利标题（中）： 使用声波的薄膜过程监测技术
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申请号： US745005申请日： 1991-08-14
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公开(公告)号： US5271274A公开(公告)日： 1993-12-21
- 发明人: B. T. Khuri-Yakub , Sanjay Bhardwaj , Krishna Saraswat
- 申请人： B. T. Khuri-Yakub , Sanjay Bhardwaj , Krishna Saraswat
- 申请人地址： CA Stanford
- 专利权人： The Board of Trustees of the Leland Stanford Junior University
- 当前专利权人： The Board of Trustees of the Leland Stanford Junior University
- 当前专利权人地址： CA Stanford
- 主分类号： G01B17/02
- IPC分类号： G01B17/02 ; G01N29/07 ; G01N29/12 ; G01N29/10 ; G01N29/24
摘要：
A system and method is disclosed for measuring thickness of at least one film on a substrate by propagating an acoustic wave through the film on a substrate such that echo waves are generated and received by a transducer. An output signal is generated and processed to give a thickness value. The thickness valve is obtained from the time lapse between the propagated wave and receipt of the echo wave; by the frequency domain of the echo wave; or the phase of the echo wave.