A method of the probing test comprising the steps of detecting a first scribe line of chips in a wafer, calculating a first center line of said first scribe line on the basis of the resultant, detecting a second scribe line intersecting the first scribe line, calculating a second center line of said second scribe line on the basis of the resultant, calculating a crossing point of the first and second center lines, identifying a reference pad of a first chip at predetermined position by referring to the crossing point, positioning a reference probe, which has a predetermined positional relationship with the crossing point, at the reference pad on the first chip, moving the test object. Therefore, each of the pads is respectively contacted with each of the probes.