In order to prevent the occurrence of corrosion due to the sliding of a relatively wide aluminum conductive layer (12) such as a power source conductive layer or a ground conductive layer, formed on a semiconductor substrate (11), breakage of a lower conductive layer due to the sliding of an upper aluminum conductive layer (12) in case of a multilayer interconnection, and the creation of voids in the lower aluminum conductive layer due to the moisture beneath the relatively wide metal conductive layer in case of a multi layer interconnection etc., the conductive layer structure is constructed so that the conductive layer (12) relatively great in width is divided into several conductive layer portions and so that the width of each of the divided conductive layer portions is in a range of 10 .mu.m to 40 .mu.m.