发明授权
- 专利标题： Thermosetting resin compositions
- 专利标题（中）： 热固性树脂组合物
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申请号： US928064申请日： 1992-08-11
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公开(公告)号： US5290882A公开(公告)日： 1994-03-01
- 发明人: Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
- 申请人： Toshio Shiobara , Hisashi Shimizu , Manabu Narumi
- 申请人地址： JPX Tokyo
- 专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人： Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-228266 19910813; JPX3-228267 19910813
- 主分类号： C08G59/32
- IPC分类号： C08G59/32 ; C08G59/40 ; C08G77/42 ; C08L61/06 ; C08L63/00 ; C08L79/08 ; C08L83/04 ; C08L63/04 ; C08L63/10
摘要：
A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.
公开/授权文献
- US5948364A Ball and socket closure for specimen collection container 公开/授权日：1999-09-07