发明授权
- 专利标题： Semiconductor device including an electrode
- 专利标题（中）： 包括电极的半导体装置
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申请号： US929472申请日： 1992-08-13
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公开(公告)号： US5298793A公开(公告)日： 1994-03-29
- 发明人: Jutaro Kotani , Masahiro Ihara , Hideaki Nakura , Masami Yokozawa
- 申请人： Jutaro Kotani , Masahiro Ihara , Hideaki Nakura , Masami Yokozawa
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electronics Corporation
- 当前专利权人： Matsushita Electronics Corporation
- 当前专利权人地址： JPX Osaka
- 优先权： JPX2-29029 19900208
- 主分类号： H01L21/28
- IPC分类号： H01L21/28 ; H01L21/607 ; H01L23/485 ; H01L23/532 ; H01L29/43 ; H01L23/48 ; H01L29/44
摘要：
There is disclosed a semiconductor device having an electrode for wire bonding, comprising a first aluminum layer, a nickel-aluminum alloy layer, and a second aluminum layer. The electrode is suitable for bonding with copper wire, since the electrode withstands a wide range of bonding conditions--mechanical pressure, ultrasonic wave power and such, and permits a reliable electrical connection to be maintained.
公开/授权文献
- US4247534A Radiographic scanning agent 公开/授权日：1981-01-27
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