发明授权
- 专利标题： Semiconductor apparatus of module installing type
- 专利标题（中）： 模块安装型半导体装置
-
申请号： US961394申请日： 1992-10-15
-
公开(公告)号： US5315482A公开(公告)日： 1994-05-24
- 发明人: Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
- 申请人： Akira Tanaka , Hiroichi Shinohara , Kazuji Yamada , Takao Ohba , Akira Yamagiwa , Hitoshi Yoshidome , Yuji Shirai , Toshio Hatada , Munehisa Kishimoto , Michiharu Honda
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-272330 19911021
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L23/367 ; H01L25/10 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/00 ; H05K3/36 ; H05K7/20
摘要：
A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.