公开(公告)号：US5315482A

公开(公告)日：1994-05-24

申请号：US961394

申请日：1992-10-15

申请人： Akira Tanaka ,  Hiroichi Shinohara ,  Kazuji Yamada ,  Takao Ohba ,  Akira Yamagiwa ,  Hitoshi Yoshidome ,  Yuji Shirai ,  Toshio Hatada ,  Munehisa Kishimoto ,  Michiharu Honda

发明人： Akira Tanaka ,  Hiroichi Shinohara ,  Kazuji Yamada ,  Takao Ohba ,  Akira Yamagiwa ,  Hitoshi Yoshidome ,  Yuji Shirai ,  Toshio Hatada ,  Munehisa Kishimoto ,  Michiharu Honda

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L25/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/36 ,  H05K7/20

CPC分类号： H05K1/021 ,  H01L23/367 ,  H01L25/105 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/182 ,  H05K2203/049 ,  H05K3/0061 ,  H05K3/366

摘要： A semiconductor apparatus comprises a heat diffusing plate and a surface installing printed board. A semiconductor device of a high heat generation is installed on the heat diffusing plate. A surface installing package and chip parts are installed on both surfaces of the printed board. A through hole is formed at the center of the printed board so that the semiconductor device is located at the center. The heat diffusing plate on which the semiconductor device has been installed and the surface installing printed board are connected and integrated.

摘要翻译： 半导体装置包括热扩散板和表面安装印刷板。 在散热板上安装有高发热的半导体装置。 表面安装封装和芯片部件安装在印刷电路板的两个表面上。 在印刷电路板的中心形成通孔，使得半导体器件位于中心。 已经安装了半导体器件的散热板和表面安装印刷板连接并整合。

公开(公告)号：US5761049A

公开(公告)日：1998-06-02

申请号：US531543

申请日：1995-09-15

申请人： Hitoshi Yoshidome ,  Takashi Maruyama ,  Kazuo Hirota

发明人： Hitoshi Yoshidome ,  Takashi Maruyama ,  Kazuo Hirota

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K7/02 ,  H05K9/00

CPC分类号： H05K1/0231 ,  H05K1/114 ,  H05K2201/09236 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

摘要： An apparatus comprises a condenser such as a condenser for reducing power source noise to be implemented on a board, a conductor for supplying a current passing through the condenser, and a current path comprising conductors and components which are installed in the neighborhood of at least one of the condenser and conductor and the effective inductance component of the condenser is reduced by passing a current through the current path in the phase opposite to that of a current passing through the condenser and conductor.

摘要翻译： 一种装置包括诸如用于减少要在电路板上实现的电源噪声的电容器的电容器，用于提供通过电容器的电流的导体，以及包括导体和部件的电流路径，该导体和部件安装在至少一个 通过使电流通过与通过冷凝器和导体的电流相反的相位的电流来减小冷凝器和导体的有效电感分量。

公开(公告)号：US5724591A

公开(公告)日：1998-03-03

申请号：US592236

申请日：1996-01-26

申请人： Tsutomu Hara ,  Takashi Maruyama ,  Hitoshi Yoshidome ,  Ryuichi Hattori ,  Tsunehiro Tobita

发明人： Tsutomu Hara ,  Takashi Maruyama ,  Hitoshi Yoshidome ,  Ryuichi Hattori ,  Tsunehiro Tobita

IPC分类号： G06F1/04 ,  G06F1/32 ,  G06F1/26

CPC分类号： G06F1/3215 ,  G06F1/3237 ,  Y02B60/1221

摘要： A multiprocessor system is provided with processor units which are grouped beforehand into some groups, a system status monitoring unit for monitoring a key input operation of a keyboard, a power demand monitoring unit for calculating the difference between the total power demand of the processor units at the present time and the total power demand of the processor units in a low power-demand mode which is measured beforehand, when the key input operation is not carried out in a normal operation mode for a predetermined time, and an operation clock controller for successively reducing or stopping operation clocks supplied to the respective processor units for each group in turn to shift the current mode to the low power-demand mode. With this construction, a power variation which occurs at the time of the switching operation between the normal operation mode and the low power-demand mode or at the time of power supply/power shut-off can be reduced.

摘要翻译： 多处理器系统设置有预先分组成一些组的处理器单元，用于监视键盘的键输入操作的系统状态监视单元，用于计算处理器单元的总功率需求之间的差异的功率需求监控单元 当在预定时间内在正常操作模式下执行键输入操作时，预先测量的低功率需求模式下的处理器单元的当前时间和总功率需求;以及连续地执行的操作时钟控制器 依次向每个组提供给相应的处理器单元的操作时钟或者停止操作时钟将当前模式转换到低功率需求模式。 利用这种结构，可以减少在正常操作模式和低功率需求模式之间或在电源/电源切断时的开关操作时发生的电力变化。

公开(公告)号：US5491301A

公开(公告)日：1996-02-13

申请号：US172413

申请日：1993-12-22

申请人： Yutaka Akiba ,  Kunio Matsumoto ,  Makoto Iida ,  Takashi Maruyama ,  Tsutomu Hara ,  Hitoshi Yoshidome ,  Kazuo Hirota

发明人： Yutaka Akiba ,  Kunio Matsumoto ,  Makoto Iida ,  Takashi Maruyama ,  Tsutomu Hara ,  Hitoshi Yoshidome ,  Kazuo Hirota

IPC分类号： H01L23/552 ,  H05K1/02 ,  H05K9/00 ,  H05K1/00

CPC分类号： H01L23/552 ,  H05K1/0218 ,  H05K9/0039 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0213 ,  H05K2201/0715

摘要： A shielding method which utilizes a three dimensional structure and is effective to a source of the electromagnetic radiation noise, and a circuit board employing the same are obtained. Further, for the purpose of making the shielding function at an enclosure level unnecessary and realizing the recycling of enclosure materials by using this circuit board, in a circuit board structure having at least a signal layer, a power source layer and a ground layer, a signal line on the signal layer which is sandwiched between the two conductor layers made up of the power source layer and the ground layer, or the power source layers or the ground layers, is enclosed in a three dimensional manner with the conductor layers, thereby to form a single or double electrical closed loop current path or paths. By adopting this structure, there is obtained the effect that the electromagnetic radiation noise radiated from the circuit board is greatly reduced. In addition, as a result, there is obtained the effect that since the shielding processing required for the enclosure becomes unnecessary, the enclosure materials can be recycled.

摘要翻译： 获得利用三维结构并对电磁辐射噪声的源有效的屏蔽方法，以及使用该屏蔽方法的电路板。 此外，为了不需要屏蔽功能，并且通过使用该电路板实现外壳材料的再循环，在至少具有信号层，电源层和接地层的电路板结构中， 被夹在由电源层和接地层构成的两个导体层之间的信号层上的信号线或者电源层或接地层的信号线被三维地封装在导体层中，从而 形成单电或双电闭环电流路径或路径。 通过采用这种结构，可以获得从电路板辐射的电磁辐射噪声大大降低的效果。 此外，结果获得了由于外壳所需的屏蔽处理变得不必要的效果，所以外壳材料可以被再循环。