发明授权
- 专利标题： Photosensitive composition and resin-encapsulated semiconductor device
- 专利标题（中）： 光敏组合物和树脂封装的半导体器件
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申请号： US158490申请日： 1993-11-29
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公开(公告)号： US5340684A公开(公告)日： 1994-08-23
- 发明人: Rumiko Hayase , Masayuki Oba , Naoko Kihara , Yukihiro Mikogami
- 申请人： Rumiko Hayase , Masayuki Oba , Naoko Kihara , Yukihiro Mikogami
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX1-316377 19891207; JPX2-56433 19900309
- 主分类号： G03F7/075
- IPC分类号： G03F7/075 ; H01L21/312 ; H01L23/29 ; G03F7/023 ; G03F7/115
摘要：
A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.