公开(公告)号：US5340684A

公开(公告)日：1994-08-23

申请号：US158490

申请日：1993-11-29

申请人： Rumiko Hayase ,  Masayuki Oba ,  Naoko Kihara ,  Yukihiro Mikogami

发明人： Rumiko Hayase ,  Masayuki Oba ,  Naoko Kihara ,  Yukihiro Mikogami

IPC分类号： G03F7/075 ,  H01L21/312 ,  H01L23/29 ,  G03F7/023 ,  G03F7/115

CPC分类号： H01L21/312 ,  G03F7/0754 ,  G03F7/0757 ,  G03F7/0758 ,  H01L23/293 ,  H01L2924/0002 ,  Y10S430/106

摘要： A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.

摘要翻译： 光敏组合物含有由具有羟基的重复单元和具有硅氧烷键的重复单元或具有羟基的重复单元，具有硅氧烷键的重复单元和除了这两个重复的重复单元之外的重复单元构成的聚酰亚胺 单元，以及由萘化二叠氮磺酸或苯醌二叠氮磺酸的酯化合物或酰胺 - 酯化合物组成的感光剂。 光敏组合物用作半导体器件或光致抗蚀剂的钝化膜。

公开(公告)号：US5518864A

公开(公告)日：1996-05-21

申请号：US220058

申请日：1994-03-30

申请人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

发明人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

IPC分类号： G03F7/023 ,  G03F7/038 ,  G03F7/38

CPC分类号： G03F7/0387 ,  G03F7/0233

摘要： Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

摘要翻译： 公开了含有具有下述通式（1）表示的重复单元的聚酰胺酸衍生物和感光性化合物（1）的感光性树脂组合物，其中R1表示四价有机基团，R2表示二价有机基团 并且R 3和R 4表示一价有机基团，R 3和R 4中的至少一个是至少具有与芳环键合的羟基的有机基团。 用感光性树脂组合物涂布半导体基板，然后通过图案化掩模使涂膜曝光，随后进行显影和热处理，以形成聚酰亚胺膜图案。 在曝光步骤之后立即施加烘烤处理。 本发明的感光性树脂组合物在半导体基板上具有正性或负性光致抗蚀剂膜的功能和聚酰亚胺保护膜的功能。

公开(公告)号：US5348835A

公开(公告)日：1994-09-20

申请号：US766334

申请日：1991-09-27

申请人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

发明人： Masayuki Oba ,  Rumiko Hayase ,  Naoko Kihara ,  Shuzi Hayase ,  Yukihiro Mikogami ,  Yoshihiko Nakano ,  Naohiko Oyasato ,  Shigeru Matake ,  Kei Takano

IPC分类号： G03F7/023 ,  G03F7/038 ,  G03F7/30

CPC分类号： G03F7/0387 ,  G03F7/0233

摘要： Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

摘要翻译： 公开了一种感光性树脂组合物，其含有具有下述通式（1）表示的重复单元的聚酰胺酸衍生物和感光性化合物：其中，R 1表示四价有机基团，R 2表示二价有机基团， R3和R4表示一价有机基团，R3和R4中的至少一个是至少具有与芳环键合的羟基的有机基团。 用感光性树脂组合物涂布半导体基板，然后通过图案化掩模将涂膜曝光，随后进行显影和热处理，以形成聚酰亚胺膜图案。 在曝光步骤之后立即施加烘烤处理。 本发明的感光性树脂组合物在半导体基板上具有正性或负性光致抗蚀剂膜的功能和聚酰亚胺保护膜的功能。

公开(公告)号：US5578697A

公开(公告)日：1996-11-26

申请号：US413173

申请日：1995-03-29

申请人： Yoshiaki Kawamonzen ,  Masayuki Oba ,  Yukihiro Mikogami ,  Shigeru Matake ,  Shuzi Hayase ,  Satoshi Mikoshiba

发明人： Yoshiaki Kawamonzen ,  Masayuki Oba ,  Yukihiro Mikogami ,  Shigeru Matake ,  Shuzi Hayase ,  Satoshi Mikoshiba

IPC分类号： C08G73/10 ,  G03F7/038 ,  H01L23/29 ,  H01L23/498 ,  H01L23/532

CPC分类号： G03F7/0387 ,  C08G73/1025 ,  C08G73/1039 ,  C08G73/106 ,  H01L23/293 ,  H01L23/49894 ,  H01L23/5329 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/181 ,  Y10T428/2969 ,  Y10T428/31504 ,  Y10T428/31721

摘要： A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40. ##STR1##

摘要翻译： 具有通过聚合（a）将通式（DA1）表示的含有0.40摩尔当量以上的芳香族二胺化合物的二胺成分为0.97〜1.03摩尔当量的聚合物前体，和（b）含有 （1-n1 / 2）摩尔当量的四羧酸二酐和n1摩尔当量的选自马来酸酐和马来酸酐的至少一种，其中n1为0.02至0.40。 （图）

公开(公告)号：US5756254A

公开(公告)日：1998-05-26

申请号：US654215

申请日：1996-05-28

申请人： Naoko Kihara ,  Satoshi Saito ,  Hiromitsu Wakabayashi ,  Makoto Nakase ,  Masayuki Oba

发明人： Naoko Kihara ,  Satoshi Saito ,  Hiromitsu Wakabayashi ,  Makoto Nakase ,  Masayuki Oba

IPC分类号： G03F7/004 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0045 ,  G03F7/039 ,  Y10S430/106 ,  Y10S430/111

摘要： A resist comprising a sulfonyl compound represented by the following general formula (1): ##STR1## wherein R.sup.1 is a hydrogen atom, a halogen atom, nitro group, cyano group or a monovalent organic group, R.sup.2 is a halogen atom, nitro group, cyano group or a monovalent organic group, R.sup.3 is a bivalent organic group, and n is an integer of 2 or more. The R.sup.3 in the general formula (1) is preferably a bivalent organic group represented by the general formula (2): ##STR2## wherein R.sup.21, R.sup.22, R.sup.23, R.sup.24, R.sup.25 and R.sup.26 may be the same or different and are individually a hydrogen atom, a halogen atom, nitro group, cyano group or a monovalent organic group, and Z is a bivalent organic group.

摘要翻译： 包含由以下通式（1）表示的磺酰基化合物的抗蚀剂：其中R1是氢原子，卤素原子，硝基，氰基或一价有机基团，R2是卤素原子， 硝基，氰基或一价有机基团，R 3为二价有机基团，n为2以上的整数。 通式（1）中的R 3优选为由通式（2）表示的二价有机基团：其中R 21，R 22，R 23，R 24，R 25和R 26可以相同或不同，为 分别为氢原子，卤素原子，硝基，氰基或一价有机基团，Z为二价有机基团。

公开(公告)号：US5753407A

公开(公告)日：1998-05-19

申请号：US653319

申请日：1996-05-24

申请人： Masayuki Oba

发明人： Masayuki Oba

IPC分类号： C08G73/10 ,  C08L79/08 ,  G02F1/1337 ,  G03F7/023

CPC分类号： G03F7/0233 ,  C08G73/1007 ,  C08G73/1025 ,  C08L79/08 ,  G02F1/133723 ,  G02F1/133753

摘要： Disclosed herein is a polyamic acid composition which comprises an aromatic carboxylic acid compound having phenolic hydroxyl groups, polyamic acid, and a photosensitizer made of a diazide compound, and which can form a polyimide film pattern having a high resolution and capable of firmly adhering to a substrate.

摘要翻译： 本文公开了一种聚酰胺酸组合物，其包含具有酚羟基的芳族羧酸化合物，聚酰胺酸和由重氮化合物制成的光敏剂，并且其可以形成具有高分辨率并能够牢固粘附于 基质。\！

公开(公告)号：US06159654A

公开(公告)日：2000-12-12

申请号：US221113

申请日：1998-12-28

申请人： Shigeru Machida ,  Yoshiaki Kawamonzen ,  Masayuki Oba

发明人： Shigeru Machida ,  Yoshiaki Kawamonzen ,  Masayuki Oba

IPC分类号： G03F7/004 ,  C08G73/10 ,  C08K5/04 ,  C08K5/16 ,  C08K5/34 ,  C08K5/36 ,  C08K5/51 ,  C08L79/04 ,  C08L79/08 ,  C08L101/00 ,  C09K9/00 ,  G03F7/028 ,  G03F7/037 ,  G03F7/038 ,  G03F7/38 ,  H01L21/027 ,  G03C1/73

CPC分类号： G03F7/037 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A negative photosensitive polymer composition, which comprises a thermosetting polymer precursor which can be cured through cyclodehydration upon heating, and a photosensitive heat cure accelerator which is capable of accelerating a curing upon irradiation of light (cyclodehydration accelerating property). This photosensitive heat cure accelerator may be a compound which is capable of increasing molecular weight and raising volatilization temperature upon irradiation of light, or a compound which is capable of generating a carboxyl group upon irradiation of light thereby exhibiting a heat cure-accelerating property, and is formed of an aromatic hydrocarbon or aromatic heterocyclic compound having at least one hydroxyl group, substituted or unsubstituted amino group or mercapto group.

摘要翻译： 一种负型光敏聚合物组合物，其包含可通过加热时通过环化脱水固化的热固性聚合物前体，以及能够在照射光时加速固化的光敏热固化促进剂（环化脱水加速性）。 该感光性热固化促进剂可以是能够增加分子量并且在照射光时提高挥发温度的化合物，或能够在光照射下产生羧基的化合物，从而表现出热固化促进性的化合物，以及 由具有至少一个羟基，取代或未取代的氨基或巯基的芳族烃或芳族杂环化合物形成。

公开(公告)号：US4376206A

公开(公告)日：1983-03-08

申请号：US131804

申请日：1980-03-19

申请人： Masayuki Oba ,  Motoo Kawamata ,  Hikotada Tsuboi ,  Nobuhito Koga

发明人： Masayuki Oba ,  Motoo Kawamata ,  Hikotada Tsuboi ,  Nobuhito Koga

IPC分类号： C07D207/44 ,  C07D207/448 ,  C07D207/452 ,  C08G73/12 ,  C07D207/40

CPC分类号： C07D207/448 ,  C07D207/452 ,  C08G73/12

摘要： Disclosed are novel alkenylphenylmaleimide derivatives having the general formula ##STR1## where R is an alkenyl radical of from 3 to 12 carbon atoms, R' is a hydrogen atom, a halogen atom, or a straight-chain or branched alkyl radical of from 1 to 4 carbon atoms, and n is a whole number of from 1 to 4, and linear dimers thereof as well as a process for the preparation of such maleimide compounds.

摘要翻译： 公开了具有通式为“IMAGE”的新的烯基苯基马来酰亚胺衍生物，其中R是3至12个碳原子的烯基，R'是氢原子，卤素原子或直链或支链烷基， 4个碳原子，n为1〜4的整数，以及其线性二聚体以及这些马来酰亚胺化合物的制备方法。

公开(公告)号：US5756650A

公开(公告)日：1998-05-26

申请号：US816595

申请日：1997-03-13

申请人： Yoshiaki Kawamonzen ,  Masayuki Oba ,  Satoshi Mikoshiba ,  Shigeru Matake

发明人： Yoshiaki Kawamonzen ,  Masayuki Oba ,  Satoshi Mikoshiba ,  Shigeru Matake

IPC分类号： G02F1/1337 ,  C08G73/10 ,  C08K5/16 ,  C08L79/08 ,  H01B3/30

CPC分类号： C08G73/1007 ,  C08G73/1028 ,  H01B3/306 ,  Y10T428/2969 ,  Y10T428/31504 ,  Y10T428/31721

摘要： A polyimide precursor composition, which comprises, a polyamic acid having a repeating unit represented by the following general formula (PA), and at least one kinds of cure accelerator selected from the group consisting of a substituted or unsubstituted nitrogen-containing heterocyclic compound exhibiting an acid dissociation index "pKa" of a proton complex ranging from 0 to 8 in an aqueous solution thereof, or an N-oxide compound of said nitrogen-containing heterocyclic compound (AC1), a substituted or unsubstituted amino acid compound (AC2), and an aromatic hydrocarbon compound or an aromatic heterocyclic compound having a molecular weight of 1,000 or less and two or more hydroxyl groups (AC3): ##STR1## wherein .phi. is a quadrivalent organic group, .phi. is a bivalent organic group, R is a substituted or unsubstituted hydrocarbon group, organosilicic group or hydrogen atom.

摘要翻译： 一种聚酰亚胺前体组合物，其包含具有由以下通式（PA）表示的重复单元的聚酰胺酸和至少一种选自取代或未取代的含氮杂环化合物的固化促进剂， 在其水溶液中为0〜8的质子络合物的酸解离指数“pKa”，或所述含氮杂环化合物（AC1）的N-氧化物，取代或未取代的氨基酸化合物（AC2）和 分子量为1000以下的芳香族烃化合物或芳香族杂环化合物以及两个以上的羟基（AC3）：其中phi是四价有机基团，Phi是二价有机基团，其中R为 取代或未取代的烃基，有机硅基或氢原子。

公开(公告)号：US4506042A

公开(公告)日：1985-03-19

申请号：US471204

申请日：1983-04-04

申请人： Hikotada Tsuboi ,  Motoo Kawamata ,  Masayuki Oba ,  Nobuhito Koga

发明人： Hikotada Tsuboi ,  Motoo Kawamata ,  Masayuki Oba ,  Nobuhito Koga

IPC分类号： C08G59/40 ,  C08G73/12 ,  C08L63/00 ,  C08L67/00 ,  C08L77/00

CPC分类号： C08G73/122 ,  C08G59/4042 ,  C08G73/126

摘要： Disclosed is a curable resin composition comprising (a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyl)maleimide derivatives, and dimers and polymers thereof and (b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component (c). The resin composition may comprise a prepolymer of any two components among the three components (a), (b) and (c) and the remaining component. The resin compositions are useful as molding materials, for the fabrication of laminates, and as varnishes, including insulation varnishes and impregnating varnishes.

摘要翻译： 公开了一种可固化树脂组合物，其包含（a）至少一种选自N-（烯基苯基）马来酰亚胺衍生物和二聚体及其聚合物的马来酰亚胺化合物和（b）一种或多种环氧树脂， 其单体分子中有一个环氧基。 除了上述两种成分之外，树脂组合物可以含有作为其他成分（c）的氨基化合物。 树脂组合物可以包含三种组分（a），（b）和（c）中的任何两种组分的预聚物和剩余组分。 树脂组合物可用作模制材料，用于制造层压材料，以及作为清漆，包括绝缘清漆和浸渍清漆。